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SN74LVC1G07DCKRG4 Datasheet(PDF) 5 Page - Texas Instruments |
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SN74LVC1G07DCKRG4 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 38 page 5 SN74LVC1G07 www.ti.com SCES296AD – FEBRUARY 2000 – REVISED MAY 2016 Product Folder Links: SN74LVC1G07 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated (1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage Operating 1.65 5.5 V Data retention only 1.5 VIH High-level input voltage VCC = 1.65 V to 1.95 V 0.65 × VCC V VCC = 2.3 V to 2.7 V 1.7 VCC = 3 V to 3.6 V 2 VCC = 4.5 V to 5.5 V 0.7 × VCC VIL Low-level input voltage VCC = 1.65 V to 1.95 V 0.35 × VCC V VCC = 2.3 V to 2.7 V 0.7 VCC = 3 V to 3.6 V 0.8 VCC = 4.5 V to 5.5 V 0.3 × VCC VI Input voltage 0 5.5 V VO Output voltage 0 5.5 V IOL Low-level output current VCC = 1.65 V 4 mA VCC = 2.3 V 8 VCC = 3 V 16 24 VCC = 4.5 V 32 Δt/Δv Input transition rise or fall rate VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20 ns/V VCC = 3.3 V ± 0.3 V 10 VCC = 5 V ± 0.5 V 5 TA Operating free-air temperature DSBGA package –40 85 °C All other packages –40 125 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) SN74LVC1G07 UNIT DBV DCK DRL DRY YZP DPW 5 PINS 5 PINS 5 PINS 6 PINS 5 PINS 4 PINS RθJA Junction-to-ambient thermal resistance 229 278 243 439 130 340 °C/W RθJC(top) Junction-to-case (top) thermal resistance 164 93 78 277 54 215 RθJB Junction-to-board thermal resistance 62 65 78 271 51 294 ψJT Junction-to-top characterization parameter 44 2 10 84 1 41 ψJB Junction-to-board characterization parameter 62 64 77 271 50 294 RθJC(bot) Junction-to-case (bottom) thermal resistance – – – – – 250 |
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