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SN74LVCH16244A Datasheet(PDF) 7 Page - Texas Instruments |
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SN74LVCH16244A Datasheet(HTML) 7 Page - Texas Instruments |
7 / 26 page SN74LVCH16244A www.ti.com SCES494B – OCTOBER 2003 – REVISED JUNE 2014 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Operating 1.65 3.6 VCC Supply voltage V Data retention only 1.5 VCC = 1.65 V to 1.95 V 0.65 × VCC VIH High-level input voltage VCC = 2.3 V to 2.7 V 1.7 V VCC = 2.7 V to 3.6 V 2 VCC = 1.65 V to 1.95 V 0.35 × VCC VIL Low-level input voltage VCC = 2.3 V to 2.7 V 0.7 V VCC = 2.7 V to 3.6 V 0.8 VI Input voltage 0 5.5 V High or low state 0 VCC VO Output voltage V 3-state 0 5.5 VCC = 1.65 V –4 VCC = 2.3 V –8 IOH High-level output current mA VCC = 2.7 V –12 VCC = 3 V –24 VCC = 1.65 V 4 VCC = 2.3 V 8 IOL Low-level output current mA VCC = 2.7 V 12 VCC = 3 V 24 Δt/Δv Input transition rise or fall rate 10 ns/V TA Operating free-air temperature –40 125 °C (1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 7.4 Thermal Information DGG DGV DL THERMAL METRIC(1) UNIT 48 PINS 48 PINS 48 PINS RθJA Junction-to-ambient thermal resistance 64.3 78.4 68.4 RθJC(top) Junction-to-case (top) thermal resistance 17.6 30.7 34.7 RθJB Junction-to-board thermal resistance 31.5 41.8 41.0 °C/W ψJT Junction-to-top characterization parameter 1.1 3.8 12.3 ψJB Junction-to-board characterization parameter 31.2 41.3 40.4 RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2003–2014, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: SN74LVCH16244A |
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