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SN74HC273DWRE4 Datasheet(PDF) 4 Page - Texas Instruments

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Part # SN74HC273DWRE4
Description  Octal D-Type Flip-Flops With Clear
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

SN74HC273DWRE4 Datasheet(HTML) 4 Page - Texas Instruments

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SN54HC273, SN74HC273
SCLS136E – DECEMBER 1982 – REVISED JULY 2016
www.ti.com
Product Folder Links: SN54HC273 SN74HC273
Submit Documentation Feedback
Copyright © 1982–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage
–0.5
7
V
IIK
Input clamp current(2)
VI < 0 or VI > VCC
±20
mA
IOK
Output clamp current(2)
VO < 0 or VO > VCC
±20
mA
IO
Continuous output current
VO = 0 to VCC
±25
mA
Continuous current through VCC or GND
±50
mA
TJ
Junction temperature
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions.
6.2 ESD Ratings – SN74HC273
VALUE
UNIT
V(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±500
(1)
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
NOM
MAX
UNIT
VCC
Supply voltage
2
5
6
V
VIH
High-level input voltage
VCC = 2 V
1.5
V
VCC = 4.5 V
3.15
VCC = 6 V
4.2
VIL
Low-level input voltage
VCC = 2 V
0.5
V
VCC = 4.5 V
1.35
VCC = 6 V
1.8
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
∆t/∆v
Input transition rise and fall time
VCC = 2 V
1000
ns
VCC = 4.5 V
500
VCC = 6 V
400
TA
Operating free-air temperature
SN54HC273
–55
125
°C
SN74HC273
–40
85


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