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XRA1404 Datasheet(PDF) 3 Page - Exar Corporation

Part No. XRA1404
Description  8-BIT SPI GPIO EXPANDER WITH INTEGRATED LEVEL SHIFTERS
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Maker  EXAR [Exar Corporation]
Homepage  http://www.exar.com
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XRA1404 Datasheet(HTML) 3 Page - Exar Corporation

 
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XRA1404
3
REV. 1.0.0
8-BIT SPI GPIO EXPANDER WITH INTEGRATED LEVEL SHIFTERS
PIN DESCRIPTIONS
Pin Description
NAME
PIN#
PIN#
TYPE
DESCRIPTION
SPI INTERFACE
SO
13
15
O
SPI serial data output.
SCL
12
14
I
SPI serial input clock.
IRQ#
11
13
OD
Interrupt output (open-drain, active LOW).
CS#
16
2
I
SPI bus chip select.
SI
1
3
I
SPI serial data input.
GPIOs
P0
P1
P2
P3
P4
P5
P6
P7
2
3
4
5
7
8
9
10
4
5
6
7
9
10
11
12
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
General purpose I/Os P0-P7. All GPIOs are configured as inputs upon power-
up or after a reset.
ANCILLARY SIGNALS
VCCP
14
16
Pwr
1.65V to 3.6V VCC supply voltage for GPIOs.
VCC
15
1
Pwr
1.65V to 3.6V VCC supply voltage for SPI bus interface.
GND
6
8
Pwr
Power supply common, ground.
GND
Center
Pad
-
Pwr
The exposed pad at the bottom surface of the package is designed for thermal
performance. Use of a center pad on the PCB is strongly recommended for ther-
mal conductivity as well as to provide mechanical stability of the package on the
PCB. The center pad is recommended to be solder masked defined with open-
ing size less than or equal to the exposed thermal pad on the package bottom to
prevent solder bridging to the outer leads of the device. Thermal vias must be
connected to GND plane as the thermal pad of package is at GND potential.
Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open Drain.
QFN-16 TSSOP-16


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