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LM4040CIM3-2.0 Datasheet(PDF) 5 Page - Texas Instruments

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Part No. LM4040CIM3-2.0
Description  LM4040-N/-Q1 Precision Micropower Shunt Voltage Reference
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Maker  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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LM4040CIM3-2.0 Datasheet(HTML) 5 Page - Texas Instruments

 
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LM4040-N, LM4040-N-Q1
www.ti.com
SNOS633K – OCTOBER 2000 – REVISED JUNE 2016
Product Folder Links: LM4040-N LM4040-N-Q1
Submit Documentation Feedback
Copyright © 2000–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3)
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
RθJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax − TA)/RθJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4040-N,
TJmax = 125°C, and the typical thermal resistance (RθJA), when board mounted, is 326°C/W for the SOT-23 package, and 180°C/W with
0.4
″ lead length and 170°C/W with 0.125″ lead length for the TO-92 package and 415°C/W for the SC70 Package.
(4)
For definitions of Peak Reflow Temperatures for Surface Mount devices, see the TI Absolute Maximum Ratings for Soldering Application
Report (SNOA549).
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
Reverse current
20
mA
Forward current
10
mA
Power dissipation (TA =
25°C)(3)
SOT-23 (M3) package
306
mW
TO-92 (Z) package
550
mW
SC70 (M7) package
241
mW
Soldering temperature(4)
SOT-23 (M3) Package Peak Reflow (30 sec)
260
°C
TO-92 (Z) Package Soldering (10 sec)
260
°C
SC70 (M7) Package Peak Reflow (30 sec)
260
°C
Storage temperature
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±200


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