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ISD4004 Datasheet(PDF) 4 Page - Winbond

Part # ISD4004
Description  Single-Chip Voice Record/Playback Devices 8-, 10-, 12-, and 16-Minute Durations
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Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond

ISD4004 Datasheet(HTML) 4 Page - Winbond

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ISD4004 Series
iv
Voice Solutions in Silicon™
FIGURES, CHARTS, AND TABLES IN THE ISD4004 SERIES DATA SHEET
Figure 1:
ISD4004 Series TSOP and PDIP/SOIC Pinouts
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Figure 2:
ISD4004 Series ANA IN Modes
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Figure 3:
SPI Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4:
SPI Interface Simplified Block Diagram
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 5:
Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 6:
8-Bit Command Format
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 7:
24-Bit Command Format
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 8:
Playback/Record and Stop Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 9:
Application Example Using SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 10:
Application Example Using Microwire . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 11:
Application Example Using SPI Port on Microcontroller . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 12:
28-Lead 8x13.4 mm Plastic Thin Small Outline Package (TSOP) Type I (E)
. . . . . . . . 18
Figure 13:
28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP) (P)
. . . . . . . . . . . . . . . . . . . . 19
Figure 14:
28-Lead 0.300-Inch Plastic Small Outline Integrated Circuit (SOIC) (S) . . . . . . . . . . . 20
Figure 15:
ISD4004 Series Bonding Physical Layout (Unpackaged Die) . . . . . . . . . . . . . . . . . . . 21
Table 1:
External Clock Input Clocking Table
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 2:
Opcode Summary
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3:
SPI Control Register
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 4:
Absolute Maximum Ratings (Packaged Parts) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 5:
Operating Conditions (Packaged Parts)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6:
DC Parameters (Packaged Parts)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 7:
AC Parameters (Packaged Parts)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 8:
Absolute Maximum Ratings (Die) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 9:
Operating Conditions (Die)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 10:
DC Parameters (Die)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
Table 11:
AC Parameters (Die)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12
Table 12:
SPI AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 13:
Plastic Thin Small Outline Package (TSOP) Type I (E) Dimensions . . . . . . . . . . . . . . . . 18
Table 14:
Plastic Dual Inline Package (PDIP) (P) Dimensions
. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 15:
Plastic Small Outline Integrated Circuit (SOIC) (S) Dimensions . . . . . . . . . . . . . . . . . . 20
Table 16:
ISD4004 Series Device Pin/Pad Designations, with Respect to Die Center (µm)
. . . . 22


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