Voltage: 2.4 to 39 Volts

Power: 200 mWatts

RoHS Device

Page 1

REV:A

Features

-Planar die construction.

-200mW power dissipation.

-Ideally suited for automated assembly

process.

-Ultra small surface mount package.

Mechanical data

-Case: SOT-323, Molded plastic

-Terminals: Solderable per MIL-STD-

202G,method 208

-Polarity: See diagram below

-Mounting position: Any

Marking: see table on page2

CZRV3-55C2V4-G Thru CZRV3-55C39-G

Parameter

Symbol

Value

Unit

0.9

V

Dimensions in inches and (millimeter)

Power dissipation (Note 1)

200

mW

QW-BZ015

SOT-323

625

Thermal resistance, junction to ambient air

Operating junction and storage temperature range

-65 to +150

SMD Zener Diodes

Comchip Technology CO., LTD.

0.087(2.20)

0.070(1.80)

0.054(1.35)

0.045(1.15)

0.056(1.40)

0.047(1.20)

1

2

3

0.006(0.15)

0.002(0.05)

0.087(2.20)

0.078(2.00)

0.004(0.10)min.

0.004(0.10)max.

0.044(1.10)

0.035(0.90)

0.016(0.40)

0.008(0.20)

Single

Note:

1. Valid provided that device terminals are kept at ambient temperature .

2. Tested with pulses, 300μS pulse width, 2% duty cycle.