LM3508

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SNVS494C – APRIL 2007 – REVISED MAY 2013

ABSOLUTE MAXIMUM RATINGS

(1) (2) (3)

−0.3V to 6V

−0.3V to 22V

−0.3V to 22V

−0.3V to 6V

Continuous Power Dissipation

Internally Limited

Junction Temperature

+150°C

+300°C

Storage Temperature Range

-65°C to +150°C

Human Body Model

2kV

(1)

Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the

device is intended to be functional, but device parameter may not be specified. For specifications and test conditions, see the Electrical

Characteristics.

(2)

All voltages are with respect to PGND.

(3)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(4)

For more detailed soldering information and specifications, please refer to Texas Instruments' Application Note AN-1112: DSBGA Wafer

Level Chip Scale Package (Literature Number SNVA009).

(5)

The human body model is a 100pF capacitor discharged through 1.5k

Ω resistor into each pin. (MIL-STD-883 3015.7).

OPERATING CONDITIONS

(1) (2)

Input Voltage Range

2.7V to 5.5V

−30°C to +85°C

Junction Temperature Range

−30°C to +105°C

(1)

Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the

device is intended to be functional, but device parameters may not be specified. For specifications and test conditions, see the Electrical

Characteristics.

(2)

All voltages are with respect to PGND.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

part/package in the application (

THERMAL PROPERTIES

Junction to Ambient Thermal Resistance (

(1)

64.7°C/W

(1)

Junction-to-ambient thermal resistance (

the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board mesuring (102mm × 76mm × 1.6mm) with a 2 × 1 array of

thermal vias. The ground plane on the board is (50mm × 50mm). Thickness of copper layers are (36µm/18µm/18µm/36µm)

(1.5oz/1oz/1oz/1.5oz copper). Ambient temperature in simulation is +22°C, still air. Power dissipation is 1W.

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