LM34925

SNVS846F – JUNE 2012 – REVISED NOVEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

–0.3

100

V

SW to RTN

–1.5

V

SW to RTN (100 ns transient)

–5

V

BST to VCC

100

V

BST to SW

13

V

RON to RTN

–0.3

100

V

VCC to RTN

–0.3

13

V

FB to RTN

–0.3

5

V

200

°C

150

°C

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are

conditions under which operation of the device is intended to be functional. For verified specifications and test conditions, see the

Electrical Characteristics . The RTN pin is the GND reference electrically connected to the substrate.

(2)

See http://www.ti.com for other methods of soldering surface mount devices.

(3)

High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C.

6.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–55

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

2

kV

Electrostatic discharge

Charged device model (CDM), per JEDEC specification

750

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

7.5

100

V

–40

125

°C

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are

conditions under which operation of the device is intended to be functional. For verified specifications and test conditions, see the

Electrical Characteristics . The RTN pin is the GND reference electrically connected to the substrate.

(2)

High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C.

6.4 Thermal Information

LM34925

NGU

DDA

UNIT

8 PINS

Junction-to-ambient thermal resistance

41.3

41.1

°C/W

Junction-to-case (bottom) thermal resistance

3.2

2.4

°C/W

Junction-to-board thermal characteristic parameter

19.2

24.4

°C/W

Junction-to-board thermal resistance

19.1

30.6

°C/W

Junction-to-case (top) thermal resistance

34.7

37.3

°C/W

Junction-to-top thermal characteristic parameter

0.3

6.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

4

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