PRELIMINARY
CY7C1484V33
CY7C1485V33
Document #: 38-05285 Rev. *A
Page 6 of 29
BWE
Input-
Synchronous
Byte Write Enable Input, active LOW. Sampled on the rising edge of CLK. This signal must
be asserted LOW to conduct a byte write.
CLK
Input-
Clock
Clock Input. Used to capture all synchronous inputs to the device. Also used to increment the
burst counter when ADV is asserted LOW, during a burst operation.
CE1
Input-
Synchronous
Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction
with CE2 and CE3 to select/deselect the device. ADSP is ignored if CE1 is HIGH.
CE2
Input-
Synchronous
Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction
with CE1 and CE3 to select/deselect the device. (TQFP Only)
CE3
Input-
Synchronous
Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction
with CE1 and CE2 to select/deselect the device. (TQFP Only)
OE
Input-
Asynchronous
Output Enable, asynchronous input, active LOW. Controls the direction of the I/O pins.
When LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are three-stated,
and act as input data pins. OE is masked during the first clock of a read cycle when emerging
from a deselected state.
ADV
Input-
Synchronous
Advance Input signal, sampled on the rising edge of CLK. When asserted, it automatically
increments the address in a burst cycle.
ADSP
Input-
Synchronous
Address Strobe from Processor, sampled on the rising edge of CLK. When asserted LOW,
A is captured in the address registers. A[1:0] are also loaded into the burst counter. When ADSP
and ADSC are both asserted, only ADSP is recognized. ASDP is ignored when CE1 is
deasserted HIGH.
ADSC
Input-
Synchronous
Address Strobe from Controller, sampled on the rising edge of CLK. When asserted LOW,
A[x:0] is captured in the address registers. A[1:0] are also loaded into the burst counter. When
ADSP and ADSC are both asserted, only ADSP is recognized.
MODE
Input-
Static
Selects Burst Order. When tied to GND selects linear burst sequence. When tied to VDDQ or
left floating selects interleaved burst sequence. This is a strap pin and should remain static
during device operation.
ZZ
Input-
Asynchronous
ZZ “sleep” Input. This active HIGH input places the device in a non-time critical “sleep”
condition with data integrity preserved.
DQa, DPa
DQb, DPb
DQc, DPc
DQd, DPd
DQe, DPe
DQf, DPf
DQg, DPg
DQh, DPh
I/O-
Synchronous
Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is triggered
by the rising edge of CLK. As outputs, they deliver the data contained in the memory location
specified by A during the previous clock rise of the read cycle. The direction of the pins is
controlled by OE. When OE is asserted LOW, the pins behave as outputs. When HIGH, DQx
and DPx are placed in a three-state condition.DQ a,b,c,d and h are eight bits wide. DP a,b,c,d
are one bit wide.
TDO
JTAG serial output
Synchronous
Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK. (BGA Only)
TDI
JTAG serial input
Synchronous
Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK. (BGA Only)
TMS
Test Mode Select
Synchronous
This pin controls the Test Access Port state machine. Sampled on the rising edge of TCK.
(BGA Only)
TCK
JTAG serial clock
Serial clock to the JTAG circuit. (BGA Only)
VDD
Power Supply
Power supply inputs to the core of the device. Should be connected to
3.3 –5%/+5% power supply.
VSS
Ground
Ground for the core of the device. Should be connected to ground of the system.
VDDQ
I/O Power Supply
Power supply for the I/O circuitry. Should be connected to a 2.375V(min.) to VDD(max.)
VSSQ
I/O Ground
Ground for the I/O circuitry. Should be connected to ground of the system.
144M
–
NC. This pin is reserved for expansion to 144 Mb.
NC
–
No Connects.
Pin Definitions (continued)
Pin Name
I/O
Pin Description
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