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LM7805 Datasheet(PDF) 4 Page - Texas Instruments

Part No. LM7805
Description  1.5-A Fixed Voltage Regulators
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
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LM7805 Datasheet(HTML) 4 Page - Texas Instruments

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LM340, LM340A, LM7805, LM7812, LM7815
SNOSBT0K – FEBRUARY 2000 – REVISED JULY 2016
www.ti.com
Product Folder Links: LM340 LM340A LM7805 LM7812 LM7815
Submit Documentation Feedback
Copyright © 2000–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3)
The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation
(TJMAX = 125°C or 150°C), the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA). PDMAX = (TJMAX
TA)/θJA. If this dissipation is exceeded, the die temperature rises above TJMAX and the electrical specifications do not apply. If the die
temperature rises above 150°C, the device goes into thermal shutdown. For the TO-3 package (NDS), the junction-to-ambient thermal
resistance (θJA) is 39°C/W. When using a heat sink, θJA is the sum of the 4°C/W junction-to-case thermal resistance (θJC) of the TO-3
package and the case-to-ambient thermal resistance of the heat sink. For the TO-220 package (NDE), θJA is 54°C/W and θJC is 4°C/W.
If SOT-223 is used, the junction-to-ambient thermal resistance is 174°C/W and can be reduced by a heat sink (see Applications Hints on
heat sinking).If the DDPAK\TO-263 package is used, the thermal resistance can be reduced by increasing the PCB copper area
thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is
37°C/W; and with 1.6 or more inches of copper area, θJA is 32°C/W.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
DC input voltage
35
V
Internal power dissipation(3)
Internally Limited
Maximum junction temperature
150
°C
Lead temperature (soldering, 10 sec.)
TO-3 package (NDS)
300
°C
Lead temperature 1,6 mm (1/16 in) from case for 10 s
230
°C
Storage temperature
−65
150
°C
(1)
ESD rating is based on the human-body model, 100 pF discharged through 1.5 kΩ.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic
discharge
Human-body model (HBM)(1)
±2000
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Temperature (TA)
LM340A, LM340
0
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1)
LM340, LM78xx
UNIT
NDE
(TO-220)
KTT
(DDPAK/TO-263)
DCY
(SOT-223)
NDS
(TO-3)
3 PINS
3 PINS
4 PINS
2 PINS
RθJA
Junction-to-ambient thermal resistance
23.9
44.8
62.1
39
°C/W
RθJC(top) Junction-to-case (top) thermal resistance
16.7
45.6
44
2
°C/W
RθJB
Junction-to-board thermal resistance
5.3
24.4
10.7
°C/W
ψJT
Junction-to-top characterization parameter
3.2
11.2
2.7
°C/W
ψJB
Junction-to-board characterization parameter
5.3
23.4
10.6
°C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance
1.7
1.5
°C/W


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