SN74LVC1G175

SINGLE DTYPE FLIPFLOP

WITH ASYNCHRONOUS CLEAR

SCES560A − MARCH 2004 − REVISED AUGUST 2004

1

POST OFFICE BOX 655303

NanoStar

 and NanoFree Packages

Operation

Per JESD 78, Class II

− 2000-V Human-Body Model (A114-A)

− 200-V Machine Model (A115-A)

− 1000-V Charged-Device Model (C101)

description/ordering information

The SN74LVC1G175 has an asynchronous clear (CLR) input. When CLR is high, data from the input pin (D)

is transferred to the output pin (Q) on the clock’s (CLK) rising edge. When CLR is low, Q is forced into the low

state, regardless of the clock edge or data on D.

NanoStar

 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING‡

NanoStar

 − WCSP (DSBGA)

0.23-mm Large Bump − YEP

Reel of 3000

SN74LVC1G175YEPR

_ _ _D6_

−40 C to 85 C

NanoFree

 − WCSP (DSBGA)

0.23-mm Large Bump − YZP (Pb-free)

Reel of 3000

SN74LVC1G175YZPR

_ _ _D6_

−40

°C to 85°C

SOT (SOT-23) − DBV

Reel of 3000

SN74LVC1G175DBVR

C75_

SOT (SOT-23) − DBV

Reel of 250

SN74LVC1G175DBVT

C75_

SOT (SC-70) − DCK

Reel of 3000

SN74LVC1G175DCKR

D6_

SOT (SC-70) − DCK

Reel of 250

SN74LVC1G175DCKT

D6_

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one

following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition

(1 = SnPb,

Copyright

 2004, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar and NanoFree are trademarks of Texas Instruments.

DBV OR DCK PACKAGE

(TOP VIEW)

1

2

3

6

5

4

CLK

GND

D

CLR

Q

3

2

1

4

5

6

D

GND

CLK

Q

CLR

YEP OR YZP PACKAGE

(BOTTOM VIEW)

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.