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LM25056 Datasheet(PDF) 3 Page - Texas Instruments |
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LM25056 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 39 page LM25056 www.ti.com SNVS784A – JANUARY 2012 – REVISED APRIL 2013 PIN DESCRIPTIONS Pin Name Description Applications Information No. PAD Exposed Exposed pad of WQFN No internal electrical connections. Solder to the ground plane to reduce thermal Pad package resistance. 1 ADR2 SMBus address line 2 3 - state address line. Should be connected to GND, VDD, or left floating. 2 ADR1 SMBus address line 1 3 - state address line. Should be connected to GND, VDD, or left floating. 3 ADR0 SMBus address line 0 3 - state address line. Should be connected to GND, VDD, or left floating. 4 VDD Internal sub-regulator Internally sub-regulated 3.7V bias supply. Connect a 1 µF capacitor on this pin to ground output for bypassing. VDD can be driven from an external voltage for low voltage operation. 5 NC No Connect Not bonded to die. Can be connected to the ground plane. 6 NC No Connect Not bonded to die. Can be connected to the ground plane. 7 NC No Connect Not bonded to die. Can be connected to the ground plane. 8 VS- Current sense input (-) Negative IIN sense amplifer input. The voltage across the current sense resistor (RS) is measured from VS+ to this pin. 9 VS+ Current sense input (+) Positive IIN sense amplifier input. The voltage across the current sense resistor (RS) is measured from this pin to VS-. 10 NC No Connect Not bonded to die. Can be connected to the ground plane. 11 VIN Positive supply input A small 0.1 µF ceramic bypass capacitor close to this pin is recommended. VIN is measured from this pin. 12 ENABLE Enable Enable pin. This pin has a rising threshold of +1.2V to enable the LM25056. Lowering this pin below the 75mV hysteresis from the +1.2V threshold will put the part into power down mode. 13 VAUX Auxiliary voltage input Auxiliary pin allows voltage telemetry from an external source. Full scale input of 1.2V 14 NC No Connect Not bonded to die. Can be connected to the ground plane. 15 NC No Connect Not bonded to die. Can be connected to the ground plane. 16 NC No Connect Not bonded to die. Can be connected to the ground plane. 17 AGND Analog ground Connect analog ground to digital ground and then to a quiet system ground. Be sure to avoid high current return ground lines. 18 NC No Connect Not bonded to die. Can be connected to the ground plane. 19 DGND Digital ground Connect analog ground to digital ground and then to a clean system ground. Be sure to avoid high current return ground lines. 20 SDA SMBus data pin Data pin for SMBus. 21 SCL SMBus clock Clock pin for SMBus. 22 SMBA SMBus alert line Alert pin for SMBus. Active low. 23 VREF Internal reference Internally generated precision 2.82V reference used for analog to digital conversion. Connect a 1 µF ceramic capacitor on this pin to ground for bypassing. 24 DIODE External diode Connect this to a diode-configured MMBT3904 NPN transistor for temperature monitoring. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) VIN, VS-, VS+ to AGND/DGND -0.3V to 24V SCL, SDA, SMBA, ADR0, ADR1, ADR2, VDD, VAUX, DIODE, ENABLE to AGND/DGND -0.3V to 6V VS+ to VS- -0.3V to +0.3V ESD Rating(3) Human Body Model 2kV Storage Temperature -65°C to +150°C Junction Temperature +150°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional. For specifications and conditions see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (3) The human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM25056 |
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