SCANSTA112

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SNLS161I – DECEMBER 2002 – REVISED APRIL 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1)

−0.3V to +4.0V

−20 mA

−0.5V to +3.9V

−20 mA

−0.3V to +3.9V

±50 mA

±50 mA

DC Latchup Source or Sink Current

±300 mA

Junction Temperature (Plastic)

+150°C

Storage Temperature

−65°C to +150°C

Lead Temperature (Solder, 4sec)

100L NFBGA

220°C

100L TQFP

220°C

Max Package Power Capacity @ 25°C

100L NFBGA

3.57W

100L TQFP

2.11W

Thermal Resistance (

100L NFBGA

35°C/W

100L TQFP

59.1°C/W

Package Derating above +25°C

100L NFBGA

28.57mW/°C

100L TQFP

16.92mW/°C

ESD Last Passing Voltage (HBM Min)

2500V

(1)

Absolute maximum ratings are those values beyond which damage to the device may occur. The databook specifications should be met,

without exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading variables. TI

does not recommend operation of SCAN STA products outside of recommended operation conditions.

RECOMMENDED OPERATING CONDITIONS

3.0V to 3.6V

−40°C to +85°C

DC ELECTRICAL CHARACTERISTICS

Over recommended operating supply voltage and temperature ranges unless otherwise specified

Symbol

Parameter

Conditions

Min

Max

Units

Minimum High Input Voltage

2.1

V

Maximum Low Input Voltage

0.8

V

Minimum High Output Voltage

V

All Outputs and I/O Pins

Minimum High Output Voltage

2.4

V

All Outputs Loaded

Minimum High Output Voltage

2.2

V

Maximum Low Output Voltage

0.2

V

All Outputs and I/O Pins

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