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SCAN90CP02 Datasheet(PDF) 2 Page - Texas Instruments |
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SCAN90CP02 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 20 page SCAN90CP02 SNLS168M – JANUARY 2004 – REVISED APRIL 2013 www.ti.com PIN DESCRIPTIONS UQFN LQFP Pin Pin Pin I/O, Type Description Name Number Number DIFFERENTIAL INPUTS COMMON TO ALL MUXES IN0+ 9 9 I, LVDS Inverting and non-inverting differential inputs. LVDS, Bus LVDS, CML, or LVPECL IN0 − 10 10 compatible. IN1+ 12 13 I, LVDS Inverting and non-inverting differential inputs. LVDS, Bus LVDS, CML, or LVPECL IN1 − 13 14 compatible. SWITCHED DIFFERENTIAL OUTPUTS OUT0+ 27 32 O, LVDS Inverting and non-inverting differential outputs. OUT0± can be connected to any one OUT0 − 26 31 pair IN0±, or IN1±. LVDS compatible(1). OUT1+ 24 28 O, LVDS Inverting and non-inverting differential outputs. OUT1± can be connected to any one OUT1 − 23 27 pair IN0±, or IN1±. LVDS compatible(1). DIGITAL CONTROL INTERFACE SEL0, 6 7 I, LVTTL Select Control Inputs SEL1 5 6 EN0, EN1 7 8 I, LVTTL Output Enable Inputs 15 17 PEM00, 4 4 I, LVTTL Channel 0 Output Pre-emphasis Control Inputs PEM01 3 3 PEM10, 2 2 I, LVTTL Channel 1 Output Pre-emphasis Control Inputs PEM11 1 1 TDI 19 22 I, LVTTL Test Data Input to support IEEE 1149.1 features TDO 20 23 O, LVTTL Test Data Output to support IEEE 1149.1 features TMS 18 21 I, LVTTL Test Mode Select to support IEEE 1149.1 features TCK 17 19 I, LVTTL Test Clock to support IEEE 1149.1 features TRST 21 24 I, LVTTL Test Reset to support IEEE 1149.1 features N/C 8, 28 Not Connected POWER VDD 11, 14, 12, 16, I, Power VDD = 3.3V ±0.3V. At least 4 low ESR 0.01 µF bypass capacitors should be 16, 22, 18, 25, connected from VDD to GND plane. 25 29 GND See(2) 5, 11, 15, Ground reference to LVDS and CMOS circuitry. 20, 26, For the UQFN package, the DAP is used as the primary GND connection to the 30 device. The DAP is the exposed metal contact at the bottom of the UQFN-28 package. It should be connected to the ground plane with at least 4 vias for optimal AC and thermal performance. (1) The LVDS outputs do not support a multidrop (BLVDS) environment. The LVDS output characteristics of the SCAN90CP02 device have been optimized for point-to-point backplane and cable applications. (2) Note that for the UQFN package GND is not an actual pin on the package, the GND is connected thru the DAP on the back side of the UQFN package. 2 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: SCAN90CP02 |
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