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SN74LVTH16373-EP

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SCBS778B – NOVEMBER 2003 – REVISED JUNE 2016

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Copyright © 2003–2016, Texas Instruments Incorporated

(1)

All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application

report, Implications of Slow or Floating CMOS Inputs, SCBA004.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

2.7

3.6

V

High-level input voltage

2

V

Low-level input voltage

0.8

V

Input voltage

5.5

V

High-level output current

–32

mA

Low-level output current

64

mA

Δt/Δv

Input transition rise or fall rate, outputs enabled

10

ns/V

Power-up ramp rate

200

µs/V

Operating ambient temperature

I version

–40

85

°C

M version

–55

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

The package thermal impedance is calculated in accordance with JESD 51-7.

6.4 Thermal Information

SN74LVTH16373-EP

UNIT

DGG (TSSOP)

DL (SSOP)

GQL (BGA MICROSTAR

JUNIOR)

48 PINS

48 PINS

56 PINS

Junction-to-ambient thermal resistance

68.9

60.3

62.5

°C/W

Junction-to-case (top) thermal resistance

14.6

31

24.7

°C/W

Junction-to-board thermal resistance

35.8

32.1

28.9

°C/W

Junction-to-top characterization parameter

2.4

9.3

0.9

°C/W

Junction-to-board characterization parameter

35.5

31.8

28

°C/W