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LDC1000 Datasheet(PDF) 6 Page - Texas Instruments

Part # LDC1000
Description  Inductance-to-Digital Converter
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LDC1000 Datasheet(HTML) 6 Page - Texas Instruments

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LDC1000
SNOSCX2C – SEPTEMBER 2013 – REVISED SEPTEMBER 2015
www.ti.com
6.5 Electrical Characteristics
Unless otherwise specified, all limits ensured for TA = TJ = 25°C, VDD = 5.0 V, VIO = 3.3 V
(1) (2)
PARAMETER
TEST CONDITIONS
MIN(3)
TYP(4)
MAX(3)
UNIT
POWER
VDD
Analog Supply Voltage
4.75
5
5.25
V
VIO
IO Supply Voltage
VIO≤VDD
1.8
3.3
5.25
V
IDD
PWR_MODE = 1, no sensor
Supply Current on VDD pin
1.7
2.3
mA
connected
IVIO
IO Supply Current
Static current
14
µA
IDD_LP
Standby Mode Supply Current PWR_MODE = 0, no sensor
250
µA
on VDD pin
connected
tSTART
From POR to ready-to-convert. Crystal
Start-Up Time
2
ms
not used for frequency counter
LDC
ƒSENSOR_MIN
Minimum sensor frequency
5
kHz
ƒSENSOR_MAX
Maximum sensor frequency
5
MHz
ASENSOR_MIN
Minimum sensor amplitude
1
VPP
ASENSOR_MAX
Maximum sensor amplitude
4
VPP
tREC
Oscillation start-up time after RP
Recovery time
10
1/ƒsensor
under-range condition
RP_MIN
Minimum Sensor RP Range
798
RP_MAX
Maximum Sensor RP Range
3.93
M
RP_RES
RP Measurement Resolution
16
Bits
L Res
Inductance Measurement
RESPONSE_TIME = b111 (6144),
24
Bits
Resolution
ƒEXT = 8 MHz, ƒSENSOR = 5 kHz
tS_MIN
Minimum programmable settling time
192/ƒSE
Minimum Response Time
s
of digital filter
NSOR
tS_MAX
Maximum programmable settling time
6144/ƒS
Maximum Response Time
s
of digital filter
ENSOR
EXTERNAL CLOCK/CRYSTAL FOR FREQUENCY COUNTER
Crystal
Frequency
8
MHz
Startup time
30
ms
External Clock
Frequency
8
MHz
Clock Input High Voltage
VIO
V
DIGITAL I/O CHARACTERISTICS
VIH
Logic 1 Input Voltage
0.8×VIO
V
VIL
Logic 0 Input Voltage
0.2×VIO
V
VOH
Logic 1 Output Voltage
ISOURCE=400 µA
VIO–0.3
V
VOL
Logic 0 Output Voltage
ISINK=400 µA
0.3
V
IIOHL
Digital IO Leakage Current
–500
500
nA
(1)
Electrical Characteristics table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
(2)
The maximum power dissipation is a function of TJ(MAX), RθJA, and the ambient temperature, TA. The maximum allowable power
dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC
board. The package thermal impedance is calculated in accordance with JESD 51-7.
(3)
Limits are specified by testing, design, or statistical analysis at 25°C. Limits over the operating temperature range are specified through
correlations using statistical quality control (SQC) method.
(4)
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped
production material.
6
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