1

FEATURES

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

A

B

C

G2A

G2B

G1

Y7

GND

Y0

Y1

Y2

Y3

Y4

Y5

Y6

D OR PW PACKAGE

(TOP VIEW)

DESCRIPTION/ORDERING INFORMATION

SN74LVC138A-Q1

3-LINE TO 8-LINE DECODER/DEMULTIPLEXER

SCAS708B – SEPTEMBER 2003 – REVISED FEBRUARY 2008

www.ti.com

• Qualified for Automotive Applications

• ESD Protection Exceeds 2000 V Per

MIL-STD-883, Method 3015; Exceeds 200 V

Using Machine Model (C = 200 pF, R = 0)

• Operates From 2 V to 3.6 V

• Inputs Accept Voltages to 5.5 V

• Max t

• Typical V

• Typical V

The device is designed for high-performance memory-decoding or data-routing applications requiring very short

propagation delay times. In high-performance memory systems, this decoder minimizes the effects of system

decoding. When employed with high-speed memories utilizing a fast enable circuit, delay times of this decoder

and the enable time of the memory usually are less than the typical access time of the memory. This means that

the effective system delay introduced by the decoder is negligible.

The conditions at the binary-select inputs and the three enable inputs select one of eight output lines. Two

active-low enable inputs and one active-high enable input reduce the need for external gates or inverters when

expanding. A 24-line decoder can be implemented without external inverters, and a 32-line decoder requires only

one inverter. An enable input can be used as a data input for demultiplexing applications.

Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in

a mixed 3.3-V/5-V system environment.

ORDERABLE PART NUMBER

TOP-SIDE MARKING

SOIC – D

Reel of 2500

SN74LVC138AQDRQ1

L138AQ1

–40

°C to 125°C

TSSOP – PW

Reel of 2000

SN74LVC138AQPWRQ1

L138AQ1

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2003–2008, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.