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DS90UH929-Q1 Datasheet(PDF) 8 Page - Texas Instruments |
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DS90UH929-Q1 Datasheet(HTML) 8 Page - Texas Instruments |
8 / 77 page DS90UH929-Q1 SNLS458 – NOVEMBER 2014 www.ti.com 7.4 Thermal Information VQFN THERMAL METRIC(1) UNIT 64 PINS RθJA Junction-to-ambient thermal resistance 25.8 RθJC(top) Junction-to-case (top) thermal resistance 11.4 RθJB Junction-to-board thermal resistance 5.1 °C/W ψJT Junction-to-top characterization parameter 0.2 ψJB Junction-to-board characterization parameter 5.1 RθJC(bot) Junction-to-case (bottom) thermal resistance 0.8 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 8 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: DS90UH929-Q1 |
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