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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

DS90LV048A

SNLS045C – JULY 1999 – REVISED JULY 2016

DS90LV048A 3-V LVDS Quad CMOS Differential Line Receiver

1

1 Features

1

•

> 400-Mbps (200-MHz) Switching Rates

•

Flow-Through Pinout Simplifies PCB Layout

•

150-ps Channel-to-Channel Skew (Typical)

•

100-ps Differential Skew (Typical)

•

2.7-ns Maximum Propagation Delay

•

3.3-V Power Supply Design

•

High Impedance LVDS Inputs on Power Down

•

Low Power Design (40 mW at 3.3-V Static)

•

Interoperable With Existing 5-V LVDS Drivers

•

Accepts Small Swing (350 mV Typical) Differential

Signal Levels

•

Supports Input Failsafe

–

Open, Short, and Terminated

•

0 V to

−100 mV Threshold Region

•

Conforms to ANSI/TIA/EIA-644 Standard

•

Operating Temperature Range: –40°C to +85°C

•

Available in SOIC and TSSOP Package

2 Applications

•

Multifunction Printers

•

LVDS - LVCMOS Translation

3 Description

The DS90LV048A device is a quad CMOS flow-

through

differential

line

receiver

designed

for

applications requiring ultra-low power dissipation and

high data rates. The device is designed to support

data rates in excess of 400 Mbps (200 MHz) using

Low

Voltage

Differential

Signaling

(LVDS)

technology.

The DS90LV048A accepts low voltage (350 mV

typical) differential input signals and translates them

to 3-V CMOS output levels. The receiver supports a

TRI-STATE function that may be used to multiplex

outputs. The receiver also supports open, shorted,

and terminated (100-Ω) input fail-safe. The receiver

output is HIGH for all fail-safe conditions. The

DS90LV048A has a flow-through pinout for easy PCB

layout.

The EN and EN* inputs are ANDed together and

control the TRI-STATE outputs. The enables are

common to all four receivers. The DS90LV048A and

companion

LVDS

line

driver

(for

example,

DS90LV047A) provide a new alternative to high-

power PECL/ECL devices for high-speed point-to-

point interface applications.

Device Information(1)

PART NUMBER

PACKAGE

BODY SIZE (NOM)

DS90LV048A

SOIC (16)

9.90 mm × 3.91 mm

TSSOP (16)

5.00 mm × 4.40 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Functional Diagram