DS90CR483, DS90CR484

SNLS047H – FEBRUARY 2000 – REVISED APRIL 2013

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Recommended Operating Conditions (continued)

Min

Nom

Max

Units

Input Clock (TX)

33

112

MHz

Electrical Characteristics

(1) (2)

Over recommended operating supply and temperature ranges unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Units

CMOS/TTL DC SPECIFICATIONS

High Level Input Voltage

2.0

V

Low Level Input Voltage

GND

0.8

V

2.7

3.3

V

High Level Output Voltage

2.7

2.85

V

Low Level Output Voltage

0.1

0.3

V

Input Clamp Voltage

−0.79

−1.5

V

+1.8

+15

µA

Input Current

−15

0

µA

Output Short Circuit Current

−120

mA

LVDS DRIVER DC SPECIFICATIONS

Differential Output Voltage

250

345

450

mV

35

mV

Complimentary Output States

Offset Voltage

1.125

1.25

1.375

V

35

mV

Complimentary Output States

Output Short Circuit Current

−3.5

−5

mA

Output TRI-STATE Current

±1

±10

µA

LVDS RECEIVER DC SPECIFICATIONS

Differential Input High

+100

mV

Threshold

Differential Input Low

−100

mV

Threshold

Input Current

±10

µA

±10

µA

TRANSMITTER SUPPLY CURRENT

ICCTW

Transmitter Supply Current

f = 33 MHz

91.4

140

mA

Worst Case

BAL = High,

f = 66 MHz

106

160

mA

Worst Case Pattern

f = 112 MHz

155

210

mA

(Figure 1 Figure 2)

ICCTZ

Transmitter Supply Current

PD = Low

5

50

µA

Power Down

Driver Outputs in TRI-STATE during power down Mode

RECEIVER SUPPLY CURRENT

ICCRW

f = 33 MHz

125

150

mA

Receiver Supply Current

Worst Case Pattern

f = 66 MHz

200

210

mA

Worst Case

(Figure 1 Figure 3)

f = 112 MHz

250

280

mA

ICCRZ

Receiver Supply Current

PD = Low

20

100

µA

Power Down

Receiver Outputs stay low during power down mode.

(1)

(2)

Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground

4

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