HD3SS215, HD3SS215I

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SLAS971D – MAY 2014 – REVISED OCTOBER 2015

7 Specifications

7.1 Absolute Maximum Ratings

(1) (2)

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

MIN

MAX

Supply voltage

–0.5

4

V

Differential I/O

–0.5

4

Voltage

AUX_SEL, Dx_SEL

–0.5

4

V

HPDx, DDCCLK_X, DDCDAT_X

–0.5

6

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions

is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential voltages, are with respect to network ground pin.

7.2 ESD Ratings

VALUE

UNIT

±1500

V

Electrostatic discharge

Charged device model (CDM), per JEDEC specification JESD22-C101,

±1250

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Main power supply

3

3.3

3.6

V

HD3SS215

0

70

°C

Operating free-air temperature

HD3SS215I

–40

85

°C

AC coupling capacitor

75

100

200

nF

7.4 Thermal Information

HD3SS215

UNIT

RTQ (56 PIN)

ZQE (50 PIN)

Junction-to-ambient thermal resistance

90.5

71.6

°C/W

Junction-to-case (top) thermal resistance

41.9

44.1

°C/W

Junction-to-board thermal resistance

53.9

49.0

°C/W

Junction-to-top characterization parameter

1.8

2.7

°C/W

Junction-to-board characterization parameter

53.4

49.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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