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HD3SS215ZQER Datasheet(PDF) 7 Page - Texas Instruments |
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HD3SS215ZQER Datasheet(HTML) 7 Page - Texas Instruments |
7 / 32 page HD3SS215, HD3SS215I www.ti.com SLAS971D – MAY 2014 – REVISED OCTOBER 2015 7 Specifications 7.1 Absolute Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) VALUE UNIT MIN MAX Supply voltage VDD –0.5 4 V Differential I/O –0.5 4 Voltage AUX_SEL, Dx_SEL –0.5 4 V HPDx, DDCCLK_X, DDCDAT_X –0.5 6 Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to network ground pin. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±1500 V V(ESD) Electrostatic discharge Charged device model (CDM), per JEDEC specification JESD22-C101, ±1250 V all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Main power supply 3 3.3 3.6 V HD3SS215 0 70 °C TA Operating free-air temperature HD3SS215I –40 85 °C CAC AC coupling capacitor 75 100 200 nF 7.4 Thermal Information HD3SS215 THERMAL METRIC(1) UNIT RTQ (56 PIN) ZQE (50 PIN) RθJA Junction-to-ambient thermal resistance 90.5 71.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 41.9 44.1 °C/W RθJB Junction-to-board thermal resistance 53.9 49.0 °C/W ψJT Junction-to-top characterization parameter 1.8 2.7 °C/W ψJB Junction-to-board characterization parameter 53.4 49.0 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: HD3SS215 |
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