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ADN2847 Datasheet(PDF) 3 Page - Analog Devices

Part No. ADN2847
Description  3 V Dual-Loop 50 Mbps to 3.3 Gbps Laser Diode Driver
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADN2847 Datasheet(HTML) 3 Page - Analog Devices

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REV. 0
ADN2847
–3–
Parameter
Min
Typ
Max
Unit
Conditions/Comments
SUPPLY
ICC
7
50
mA
IBIAS = IMOD = 0
VCC
8
3.0
3.3
3.6
V
NOTES
1Temperature range: –40
∞C to +85∞C.
2The high speed performance for the die version of ADN2847 can be achieved when using the bonding diagram shown in Figure 3.
3Measured into a 25
W load using a 11110000 pattern at 2.5 Gbps.
4When the voltage on DATAP is greater than the voltage on DATAN, the modulation current flows in the IMODP pin.
5Guaranteed by design and characterization. Not production tested.
6IDTONE may cause eye distortion.
7I
CCMIN for power calculation on page 8 is the typical I CC given.
8All V
CC pins should be shorted together.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS
1
(T
A = 25
∞C, unless otherwise noted.)
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2 V
Digital Inputs (ALS, LBWSET, CLKSEL) . . –0.3 V to VCC + 0.3 V
IMODN, IMODP . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 1.2 V
Operating Temperature Range
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . –40
∞C to +85∞C
Storage Temperature Range . . . . . . . . . . . . . –65
∞C to +150∞C
Junction Temperature (TJ max) . . . . . . . . . . . . . . . . . . . 150
∞C
48-Lead LFCSP Package
Power Dissipation
2 . . . . . . . . . . . . . . . . (T
J max – TA)/
qJA W
qJA Thermal Impedance3 . . . . . . . . . . . . . . . . . . . . . 25∞C/W
Lead Temperature (Soldering 10 sec) . . . . . . . . . . . . 300
∞C
32-Lead LFCSP Package
Power Dissipation
2 . . . . . . . . . . . . . . . . (T
J max – TA)/
qJA W
qJA Thermal Impedance3 . . . . . . . . . . . . . . . . . . . . . 32∞C/W
Lead Temperature (Soldering 10 sec) . . . . . . . . . . . . 300
∞C
NOTES
1 Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2 Power consumption formulae are provided on page 8.
3
qJA is defined when part is soldered on a 4-layer board.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADN2847 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
ORDERING GUIDE
Temperature
Package
Model
Range
Description
ADN2847ACP-32
–40
∞C to +85∞C 32-Lead LFCSP
ADN2847ACP-48
–40
∞C to +85∞C 48-Lead LFCSP
ADN2847ACP-32-RL
–40
∞C to +85∞C 32-Lead LFCSP
ADN2847ACP-32-RL7
–40
∞C to +85∞C 32-Lead LFCSP
ADN2847ACP-48-RL
–40
∞C to +85∞C 48-Lead LFCSP
DATAP/DATAN
SETUP
HOLD
t
H
t
S
CLKP
Figure 1. Setup and Hold Time


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