0

5

10

15

20

25

40

50

60

70

80

90

100

0

2

4

6

8

10

12

Output Current (A)

G001

CSD97374Q4M

www.ti.com

SLPS382C – JANUARY 2013 – REVISED JULY 2013

Synchronous Buck NexFET™ Power Stage

1

FEATURES

APPLICATIONS

23

•

Over 92% System Efficiency at 15A

•

Ultrabook/Notebook DC/DC Converters

•

Max Rated Continuous Current 25A, Peak 60A

•

Multiphase Vcore and DDR Solutions

•

High Frequency Operation (up to 2 MHz)

•

Point-of-Load Synchronous Buck in

Networking, Telecom, and Computing Systems

•

High Density - SON 3.5x4.5-mm Footprint

•

Ultra Low Inductance Package

ORDERING INFORMATION

•

System Optimized PCB Footprint

Device

Package

Media

Qty

Ship

•

Ultra Low Quiescent (ULQ) Current Mode

SON 3.5 × 4.5-mm

13-Inch

Tape and

CSD97374Q4M

2500

Plastic Package

Reel

Reel

•

3.3V and 5V PWM Signal Compatible

•

Diode Emulation Mode with FCCM

•

Input Voltages up to 24V

•

Three-State PWM Input

•

Integrated Bootsrap Diode

•

Shoot Through Protection

•

RoHS Compliant – Lead Free Terminal Plating

•

Halogen Free

DESCRIPTION

The CSD97374Q4M NexFET™ Power Stage is a highly optimized design for use in a high power, high density

Synchronous Buck converter. This product integrates the driver IC and NexFET technology to complete the

power stage switching function. The driver IC has a built-in selectable diode emulation function that enables

DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables

Connected Standby for Windows™ 8 . With the PWM input in tri-state, quiescent current is reduced to 130 µA,

with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is

required to resume switching). This combination produces a high current, high efficiency, and high speed

switching device in a small 3.5 × 4.5-mm outline package. In addition, the PCB footprint has been optimized to

help reduce design time and simplify the completion of the overall system design.

Figure 1. Application Diagram

Figure 2. Efficiency and Power Loss

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

NexFET is a trademark of Texas Instruments.

3

All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Copyright © 2013, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Not Recommended For New Designs