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CY74FCT2541TSOCTG4 Datasheet(PDF) 2 Page - Texas Instruments |
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CY74FCT2541TSOCTG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 16 page CY74FCT2541T 8BIT BUFFER/LINE DRIVER WITH 3STATE OUTPUTS SCCS041B – SEPTEMBER 1994 – REVISED SEPTEMBER 2001 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 FUNCTION TABLE INPUTS OUTPUT OEA OEB D OUTPUT L L H L L H L H X L H Z H = High logic level, L = Low logic level, X = Don’t care, Z = High-impedance state logic diagram (positive logic) D1 D2 D3 3 4 5 O1 O2 O3 17 16 15 D4 D5 D6 D7 6 7 8 9 O4 O5 O6 O7 14 13 12 11 D0 2 O0 18 19 1 OEB OEA absolute maximum rating over operating free-air temperature range (unless otherwise noted)† Supply voltage range to ground potential –0.5 V to 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC input voltage range –0.5 V to 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC output voltage range –0.5 V to 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC output current (maximum sink current/pin) 120 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package thermal impedance, qJA (see Note 1): Q package 68 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SO package 58 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ambient temperature range with power applied, TA –65 °C to 135°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg –65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. |
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