DRV104PWP datasheet(11/26 Pages) TI1

Part #	DRV104PWP

Description	1.2A PWM High-Side Driver for Solenoids, Coils, Valves, Heaters, and Lamps

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Manufacturer	TI1 [Texas Instruments]

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DRV104

11

SBVS036B

www.ti.com

FIGURE 12. Recommended PCB Layout.

FIGURE 13. PowerPAD Heat Transfer.

FIGURE 14. Heat-Sink Thermal Resistance vs PCB Copper

Area.

PACKAGE MOUNTING

Figure 12 provides recommended printed circuit board (PCB)

layouts for the PowerPAD HTSSOP-14 package. The metal

pad of the PowerPAD HTSSOP-14 package is electrically

isolated from other pins and ideally should be connected to

a ground. For reliable operation, the PowerPAD must be

directly soldered to a circuit board, as shown in Figure 13.

Increasing the heat-sink copper area improves heat dissipa-

tion. Figure 14 shows typical junction-to-ambient thermal

resistance as a function of the PCB copper area.

POWER DISSIPATION

The DRV104 power dissipation depends on power supply,

signal, and load conditions. Power dissipation (PD) is equal to

the product of output current times the voltage across the

conducting DMOS transistor times the duty cycle. Using the

lowest possible duty cycle necessary to assure the required

hold force can minimize power dissipation in both the load and

in the DRV104. At 1A, the output DMOS transistor on-resis-

tance is 0.45

Ω, increasing to 0.65Ω at current limit.

Solder Attachment

to PCB

2.0

0.33

2.4

0.65

0.0

1.0

2.0

3.5

(all dimensions in mm)

Copper Traces

Signal Trace

Copper Pad

Thermal Vias

DRV104 Die

Pad-to-Board

Solder

THERMAL RESISTANCE vs

PCB COPPER AREA

80

70

60

50

40

30

012345

Copper Area (inches2)

DRV104

PowerPAD

Surface-Mount Package

1oz. Copper

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DRV104PWP Datasheet(PDF) 11 Page - Texas Instruments

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