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DP83867IR Datasheet(PDF) 4 Page - Texas Instruments |
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DP83867IR Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 132 page  4 DP83867IR, DP83867CR SNLS484D – FEBRUARY 2015 – REVISED JULY 2016 www.ti.com Product Folder Links: DP83867IR DP83867CR Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Changes from Revision B (August 2015) to Revision C Page • Changed the title to add DP83867IRRGZ/CRRGZ in the datasheet. ................................................................................... 1 • Added part numbers .............................................................................................................................................................. 1 • Changed latency bullet point in Featuresfor better description of the Low Latency Feature. ................................................ 1 • Changed Power consumption number in Features section.................................................................................................... 1 • Added Radiated Emissions performance to Features ............................................................................................................ 1 • Added MDI Termination Resistor in Features ........................................................................................................................ 1 • Added Programmable MAC Interface Impedance in ............................................................................................................. 1 • Added 'RJ45 Mirror Mode' to Features................................................................................................................................... 1 • Added compatibility to Features ............................................................................................................................................. 1 • Added MAC interface information in Description.................................................................................................................... 1 • Added Package information for the new devices in Device Information table ....................................................................... 1 • Added thermal information for RGZ Devices in Thermal Information .................................................................................... 2 • Added thermal information for RGZ Devices in Thermal Information .................................................................................... 4 • Added Device Comparison Table........................................................................................................................................... 7 • Changed table to add information about new RGZ devices................................................................................................... 9 • Added information about pull-up pull-down resistors in Table Note of Pin Functions table .................................................. 9 • Changed bypass capacitor information for power pins in ................................................................................................... 12 • Added Unused Pins section ................................................................................................................................................ 12 • Added Absolute Maximum Ratings table.............................................................................................................................. 13 • Added ESD information about new RGZ devices in ESD Ratings ...................................................................................... 13 • Added VDD1P0 information in Recommended Operating Conditions ................................................................................. 14 • Added temperature information about RGZ devices in Recommended Operating Conditions ........................................... 14 • Added thermal information for RGZ Devices in Thermal Information .................................................................................. 14 • Added PMD output voltage data for new RGZ devices in Electrical Characteristics .......................................................... 15 • Added RGMII TX and RX Latency values in RGMII Timing (4).............................................................................................. 19 • Added FBD for new RGZ devices in Functional Block Diagram .......................................................................................... 28 • Added "Magic Packet should be byte aligned" in Magic Packet Structure section. ............................................................. 29 • Changed "Auto-MDIX is independent of Auto-Negotiation" to "For 10/100, Auto-MDIX is independent of Auto- Negotiation" in Auto-MDIX Resolution.................................................................................................................................. 39 • Added Loopback Availability table........................................................................................................................................ 40 • Changed description for Analog Loopback........................................................................................................................... 40 • Added description for External Loopback............................................................................................................................. 41 • Changed "improperly-terminated cables with ±1m accuracy" to "improperly-terminated cables, and crossed pairs wires with ±1m accuracy" in TDR......................................................................................................................................... 42 • Added "0.5ms in 1000M mode" in Fast Link Drop section ................................................................................................... 43 • Deleted mention of FLD_CFG and FLD_THR_CFG from Fast Link Drop .......................................................................... 43 • Changed Mirror Mode Configuration table. .......................................................................................................................... 45 • Added Added internal resistor to the diagram in Strap Circuit ............................................................................................ 46 • Added Target voltage range in Strap Resistor Ratios table ................................................................................................. 46 • Added strapping information for RGZ devices in Table 6 ................................................................................................... 47 • Changed incorrect pin number for LED_1 and LED_0 in 4-Level Strap Pins table ............................................................. 48 • Added RGMII TX and RX Skew Strap information to Table 6 ............................................................................................. 48 • Added Table 8 ..................................................................................................................................................................... 49 • Added Table 9 ..................................................................................................................................................................... 49 • Added Table 10 ................................................................................................................................................................... 49 |
Similar Part No. - DP83867IR_16 |
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Similar Description - DP83867IR_16 |
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