CDCM6208V2G datasheet(2/88 Pages) TI1 | CDCM6208V2G 2:8 Clock Generator, Jitter Cleaner with Fractional Dividers

Part No.	CDCM6208V2G

Description	CDCM6208V2G 2:8 Clock Generator, Jitter Cleaner with Fractional Dividers

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Manufacturer	TI1 [Texas Instruments]

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CDCM6208V2G

SNAS682 – MARCH 2016

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Product Folder Links: CDCM6208V2G

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Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Simplified Schematics........................................... 1

5

Revision History..................................................... 2

6

Description (continued)......................................... 3

7

Pin Configuration and Functions ......................... 3

8

Specifications......................................................... 6

8.1

Absolute Maximum Ratings ..................................... 6

8.2

ESD Ratings.............................................................. 6

8.3

Recommended Operating Conditions ....................... 7

8.4

Thermal Information, Airflow = 0 LFM ..................... 7

8.5

Thermal Information, Airflow = 150 LFM ................. 8

8.6

Thermal Information, Airflow = 250 LFM ................. 8

8.7

Thermal Information, Airflow = 500 LFM ................. 8

8.8

Single Ended Input Characteristics .......................... 9

8.9

Single Ended Input Characteristics (PRI_REF,

SEC_REF) ................................................................. 9

8.10

Differential Input Characteristics (PRI_REF,

SEC_REF) ............................................................... 10

8.11

Crystal Input Characteristics (SEC_REF) ............. 10

8.12

Single Ended Output Characteristics (STATUS1,

STATUS0, SDO, SDA) ............................................ 11

8.13

PLL Characteristics ............................................... 11

8.14

LVCMOS Output Characteristics .......................... 12

8.15

LVPECL (High-Swing CML) Output

Characteristics ......................................................... 13

8.16

CML Output Characteristics .................................. 13

8.17

LVDS (Low-Power CML) Output Characteristics . 14

8.18

HCSL Output Characteristics............................... 14

8.19

Output Skew and Sync to Output Propagation Delay

Characteristics ......................................................... 15

8.20

Device Individual Block Current Consumption...... 16

8.21

Worst Case Current Consumption ........................ 17

8.22

I2C TIMING .......................................................... 18

8.23

SPI Timing Requirements ..................................... 19

8.24

Typical Characteristics ......................................... 20

9

Parameter Measurement Information ................ 22

9.1

Characterization Test Setup ................................... 22

10

Detailed Description ........................................... 28

10.1

Overview ............................................................... 28

10.2

Functional Block Diagram ..................................... 28

10.3

Feature Description............................................... 29

10.4

Device Functional Modes...................................... 30

10.5

Programming......................................................... 38

10.6

Register Maps ....................................................... 42

11

Application and Implementation........................ 54

11.1

Application Information.......................................... 54

11.2

Typical Applications .............................................. 54

12

Power Supply Recommendations ..................... 73

12.1

Power Rail Sequencing, Power Supply Ramp Rate,

and Mixing Supply Domains .................................... 73

13

Layout................................................................... 75

13.1

Layout Guidelines ................................................. 75

13.2

Layout Example .................................................... 75

14

Device and Documentation Support ................. 81

14.1

Documentation Support ....................................... 81

14.2

Community Resources.......................................... 81

14.3

Trademarks ........................................................... 81

14.4

Electrostatic Discharge Caution ............................ 81

14.5

Glossary ................................................................ 81

15

Mechanical, Packaging, and Orderable

Information ........................................................... 81

5 Revision History

DATE

REVISION

NOTES

March 2016

*

Initial release.

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