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DS110RT410SQ/NOPB Datasheet(PDF) 6 Page - Texas Instruments |
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DS110RT410SQ/NOPB Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 61 page  DS110DF410 SNLS397D – OCTOBER 2011 – REVISED APRIL 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VDD Supply voltage –0.5 2.75 V LVCMOS and Analog 2.5 I/O voltage –0.5 2.75 V SDA, SDC, INT 3.3 LVCMOS I/O voltage –0.5 4.0 V RXPn, RXNn Signal input voltage –0.5 2.75 V TXPn, TXNn Signal output voltage –0.5 2.75 V Junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±6000 Electrostatic V(ESD) Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1250 V discharge Machine model (MM), STD - JESD22-A115-A ±250 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN NOM MAX UNIT Supply Voltage (VDD to GND) 2.375 2.5 2.625 V Ambient Temperature -40 25 +85 °C 7.4 Thermal Information DS110DF410 THERMAL METRIC(1) WQFN UNIT 48 PINS RθJA Junction-to-ambient thermal resistance 26.1 RθJC(top) Junction-to-case (top) thermal resistance — RθJB Junction-to-board thermal resistance — °C/W ψJT Junction-to-top characterization parameter — ψJB Junction-to-board characterization parameter — RθJC(bot) Junction-to-case (bottom) thermal resistance — (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DS110DF410 |
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