15MB200

R4

130:

R3

130:

50:

50:

LVPECL

R1

83:

R2

83:

0.1 PF

0.1 PF

DS15MB200

www.ti.com

SNLS196E – NOVEMBER 2005 – REVISED MARCH 2013

Figure 11. AC Coupled LVDS to LVPECL Interface

terminate the transmission line, and bias the signal for the receiver.

Packaging Information

The Leadless Leadframe Package (WQFN) is a leadframe based chip scale package (CSP) that may enhance

chip speed, reduce thermal impedance, and reduce the printed circuit board area required for mounting. The

small size and very low profile make this package ideal for high density PCBs used in small-scale electronic

applications such as cellular phones, pagers, and handheld PDAs. The WQFN package is offered in the no

Pullback configuration. In the no Pullback configuration the standard solder pads extend and terminate at the

edge of the package. This feature offers a visible solder fillet after board mounting.

The WQFN has the following advantages:

•

Low thermal resistance

•

Reduced electrical parasitics

•

Improved board space efficiency

•

Reduced package height

•

Reduced package mass

For more details about WQFN packaging technology, refer to applications note AN-1187, "Leadless Leadframe

Package" (SNOA401).

Copyright © 2005–2013, Texas Instruments Incorporated

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