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DRV10975PWP Datasheet(PDF) 4 Page - Texas Instruments |
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DRV10975PWP Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 57 page  DRV10975 SLVSCP2 – JANUARY 2015 www.ti.com Pin Functions (continued) PIN I/O(1) DESCRIPTION N/AME NO. 21 W O Motor W phase 22 23 VCC P Device power supply 24 PowerPAD™ The exposed PowerPAD must be electrically connected to ground plane through soldering to PCB for — P (GND) proper operation and connected to bottom side of PCB through vias for better thermal spreading. 8 Specifications 8.1 Absolute Maximum Ratings over operating free-air temperature (unless otherwise noted) (1) MIN MAX UNIT VCC –0.3 23 SPEED –0.3 4 Input voltage(2) GND –0.3 0.3 V SCL, SDA –0.3 4 DIR –0.3 4 U, V, W –1 23 SW –1 23 VREG –0.3 7 FG –0.3 4 Output voltage(2) VCP –0.3 V(VCC) + 6 V CPN –0.3 23 CPP –0.3 V(VCC) + 6 V3P3 –0.3 4 V1P8 –0.3 2.5 TJ_MAX Maximum junction temperature –40 150 °C Tstg Storage temperature –55 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to the network ground terminal unless otherwise noted. 8.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2500 Electrostatic V(ESD) V discharge Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: DRV10975 |
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