DAC8501

2

SBAS212A

www.ti.com

Operating Temperature Range ...................................... –40

°C to +105°C

Storage Temperature Range ......................................... –65

°C to +150°C

θ

θ

Lead Temperature, Soldering:

Vapor Phase (60s) ............................................................... +215

°C

Infrared (15s) ........................................................................ +220

°C

NOTE: (1) Stresses above those listed under

Absolute Maximum Ratings may

cause permanent damage to the device. Exposure to absolute maximum

conditions for extended periods may affect device reliability.

PACKAGE/ORDERING INFORMATION

RELATIVE

DIFFERENTIAL

SPECIFICATION

ACCURACY

NONLINEARITY

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

(LSB)

(LSB)

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

DAC8501E

±64

±1

MSOP-8

DGK

–40

°C to +105°C

D01

DAC8501E/250

Tape and Reel, 250

""

"

"

"

"

"

DAC8501E/2K5

Tape and Reel, 2500

NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.

PIN

NAME

DESCRIPTION

Power-Supply Input, +2.7V to +5.5V

Reference Voltage Input

Feedback connection for the output amplifier.

Analog output voltage from DAC. The output ampli-

fier has rail-to-rail operation.

5

SYNC

Level-triggered control input (active LOW). This is

the frame synchronization signal for the input data.

When SYNC goes LOW, it enables the input shift

register and data is transferred in on the falling

edges of the following clocks. The DAC is updated

following the 24th clock cycle unless SYNC is taken

HIGH before this edge, in which case the rising

edge of SYNC acts as an interrupt and the write

sequence is ignored by the DAC8501.

6

SCLK

Serial Clock Input. Data can be transferred at rates

up to 30MHz.

Serial Data Input. Data is clocked into the 24-bit

input shift register on the falling edge of the serial

clock input.

8

GND

Ground reference point for all circuitry on the part.

PIN DESCRIPTION

PIN CONFIGURATIONS

Top View

MSOP

V

DD

V

REF

V

FB

V

OUT

GND

D

IN

SCLK

SYNC

1

2

3

4

8

7

6

5

DAC8501

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.