4

DAC80004, DAC70004, DAC60004

SLASED6B – APRIL 2016 – REVISED JUNE 2016

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Product Folder Links: DAC80004 DAC70004 DAC60004

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Voltage, VDD to GND

–0.3

7

V

Voltage, digital input or output to GND

–0.3

V

–0.3

V

Input current to any pin except supply pins

–10

10

mA

Maximum junction temperature

150

°C

-60

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

±1000

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Voltage, VDD to GND

2.7

5.5

V

Voltage, analog input (REFIN) or output

2.7 V

2.2

V

4.5 V

2.2

V

-40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

DACx0004

UNIT

DMD (VSON)

PW (TSSOP)

14 PINS

14 PINS

Junction-to-ambient thermal resistance

39.6

99.1

°C/W

Junction-to-case (top) thermal resistance

27.3

23.4

°C/W

Junction-to-board thermal resistance

9.0

42.8

°C/W

Junction-to-top characterization parameter

0.3

0.9

°C/W

Junction-to-board characterization parameter

8.9

42.0

°C/W

Junction-to-case (bottom) thermal resistance

6.5

N/A

°C/W