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F3095_R46_X2_310_110C • 6/9/2016 10

Metallized Polypropylene Film EMI Suppression Capacitors

R46 Series, Class X2, 310 VAC, 110ºC

Soldering Process cont'd

Wave Soldering Recommendations cont'd

1. The table indicates the maximum set-up temperature of the soldering process

Figure 1

Dielectric

Film Material

Maximum Preheat

Temperature

Maximum

Peak Soldering

Temperature

Capacitor

Pitch

≤10mm

Capacitor

Pitch

= 15 mm

Capacitor

Pitch

> 15 mm

Capacitor

Pitch

≤15mm

Capacitor

Pitch

> 15 mm

Polyester

130°C

130°C

130°C

270°C

270°C

Polypropylene

100°C

110°C

130°C

260°C

270°C

Paper

130°C

130°C

140°C

270°C

270°C

Polyphenylene

Sulphide

150°C

150°C

160°C

270°C

270°C

2. The maximum temperature measured inside the capacitor:

Set the temperature so that inside the element the maximum temperature is below the limit:

Dielectric Film Material

Maximum temperature

measured inside the element

Polyester

160°C

Polypropylene

110°C

Paper

160°C

Polyphenylene

sulphide

160°C

Temperature monitored inside the capacitor.

Selective Soldering Recommendations

Selectivedipsolderingisavariationofreflowsoldering.Inthismethod,theprintedcircuitboardwiththrough-holecomponentstobe

solderedispreheatedandtransportedoverthesolderbathasinnormalflowsolderingwithouttouchingthesolder.Whentheboardis

over the bath, it is stopped and pre-designed solder pots are lifted from the bath with molten solder only at the places of the selected

components, and pressed against the lower surface of the board to solder the components.

Thetemperatureprofileforselectivesolderingissimilartothedoublewaveflowsolderingoutlinedinthisdocument,however, instead

of two baths, there is only one bath with a time from 3 to 10 seconds. In selective soldering, the risk of overheating is greater than

indoublewaveflowsoldering,andgreatcaremustbetakensothatthepartsarenotoverheated.