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LM324 Datasheet(PDF) 13 Page - Texas Instruments |
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LM324 Datasheet(HTML) 13 Page - Texas Instruments |
13 / 40 page -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 0 0.5 1 1.5 2 Time (ms) VIN VOUT LM224K, LM224KA, LM324, LM324A, LM324K, LM324KA, LM2902 LM124, LM124A, LM224, LM224A, LM2902V, LM2902K, LM2902KV, LM2902KAV www.ti.com SLOS066W – SEPTEMBER 1975 – REVISED MARCH 2015 Typical Application (continued) 9.2.3 Application Curve Figure 10. Input and Output Voltages of the Inverting Amplifier 10 Power Supply Recommendations CAUTION Supply voltages larger than 32 V for a single supply, or outside the range of ±16 V for a dual supply can permanently damage the device (see the Absolute Maximum Ratings). Place 0.1- μF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high impedance power supplies. For more detailed information on bypass capacitor placement, refer to the Layout. 11 Layout 11.1 Layout Guidelines For best operational performance of the device, use good PCB layout practices, including: • Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low impedance power sources local to the analog circuitry. – Connect low-ESR, 0.1- μF ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single supply applications. • Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital and analog grounds, paying attention to the flow of the ground current. • To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as opposed to in parallel with the noisy trace. • Place the external components as close to the device as possible. Keeping RF and RG close to the inverting input minimizes parasitic capacitance, as shown in Layout Examples. • Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitive part of the circuit. • Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce leakage currents from nearby traces that are at different potentials. Copyright © 1975–2015, Texas Instruments Incorporated Submit Documentation Feedback 13 Product Folder Links: LM224K LM224KA LM324 LM324A LM324K LM324KA LM2902 LM124 LM124A LM224 LM224A LM2902V LM2902K LM2902KV LM2902KAV |
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