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CD4069UBNSR Datasheet(PDF) 4 Page - Texas Instruments |
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CD4069UBNSR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 30 page 4 CD4069UB SCHS054D – NOVEMBER 1998 – REVISED FEBRUARY 2016 www.ti.com Product Folder Links: CD4069UB Submit Documentation Feedback Copyright © 1998–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) During soldering at distance 1/16 inch ± 1/32 inch (1.59 mm ± 0.79 mm) from case for 10 s maximum 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VDD DC supply-voltage (voltages referenced to VSS terminal) –0.5 20 V VI Input voltage, all inputs –0.5 to VDD 0.5 V IIK DC input current, any one input –10 10 mA PD Power dissipation per package –55°C to 100°C 500 mW 100°C to 125°C 12 200 Device dissipation per output transistor Full range (all package types) 100 mW Lead temperature(2) 265 °C TJ Junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±500 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±200 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VDD Supply voltage 3 18 V TA Operating temperature –55 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) CD4069UB UNIT D (SOIC) J (CDIP) N (PDIP) NS (SO) PW (TSSOP) 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 94.9 — 57.9 91.2 122.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 56.4 28.5 45.5 48.8 50.8 °C/W RθJB Junction-to-board thermal resistance 49.2 — 37.7 50 63.8 °C/W ψJT Junction-to-top characterization parameter 21.1 — 30.6 15 6.3 °C/W ψJB Junction-to-board characterization parameter 48.9 — 37.6 49.6 63.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A °C/W |
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