ADS7842

SBAS103C

2

www.ti.com

PIN

NAME

DESCRIPTION

1

AIN0

Analog Input Channel 0

2

AIN1

Analog Input Channel 1

3

AIN2

Analog Input Channel 2

4

AIN3

Analog Input Channel 3

Voltage Reference Input. See Electrical Characteris-

tics Tables for ranges.

6

AGND

Analog Ground

7

DB11

Data Bit 11 (MSB)

8

DB10

Data Bit 10

9

DB9

Data Bit 9

10

DB8

Data Bit 8

11

DB7

Data Bit 7

12

DB6

Data Bit 6

13

DB5

Data Bit 5

14

DGND

Digital Ground

15

DB4

Data Bit 4

16

DB3

Data Bit 3

17

DB2

Data Bit 2

18

DB1

Data Bit 1

19

DB0

Data Bit 0 (LSB)

20

RD

Read Input. Active LOW. Reads the data outputs in

combination with CS.

21

CS

Chip Select Input. Active LOW. The combination of

CS taken LOW and WR taken LOW initiates a new

conversion and places the outputs in the tri-state

mode.

22

WR

Write Input. Active LOW. Starts a new conversion

and selects an analog channel via address inputs A0

and A1, in combination with CS.

23

BUSY

BUSY goes LOW and stays LOW during a

conversion. BUSY rises when a conversion is

complete and enables the parallel outputs.

24

CLK

External Clock Input. The clock speed determines the

25, 26

A0, A1

Address Inputs. Selects one of four analog input

channels in combination with CS and WR. The

address inputs are latched on the rising edge of

either RD or WR.

A1

A0

Channel Selected

0

0

AIN0

0

1

AIN1

1

0

AIN2

1

1

AIN3

27

Digital Supply Input. Nominally +5V.

28

Analog Supply Input. Nominally +5V.

MINIMUM

RELATIVE

SPECIFIED

ACCURACY

SINAD

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

(LSB)

(dB)

PACKAGE-LEAD

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

ADS7842E

±2

68

SSOP-28

DB

–40

°C to +85°C

ADS7842E

ADS7842E

Rails, 48

""

"

"

"

"

"

ADS7842E/1K

Tape and Reel, 1000

ADS7842EB

±1

70

SSOP-28

DB

–40

°C to +85°C

ADS7842EB

ADS7842EB

Rails, 48

""

"

"

"

"

"

ADS7842EB/1K

Tape and Reel, 1000

Digital Inputs to GND ........................................................... –0.3V to +6V

Power Dissipation .......................................................................... 250mW

Maximum Junction Temperature ................................................... +150

°C

Operating Temperature Range ........................................ –40

°C to +85°C

Storage Temperature Range ......................................... –65

°C to +150°C

Lead Temperature (soldering, 10s) ............................................... +300

°C

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degrada-

tion to complete device failure. Precision integrated circuits

may be more susceptible to damage because very small

parametric changes could cause the device not to meet its

published specifications.

PACKAGE/ORDERING INFORMATION

PIN CONFIGURATION

Top View

SSOP

PIN DESCRIPTIONS

1

2

3

4

5

6

7

8

8

10

11

12

13

14

AIN0

AIN1

AIN2

AIN3

V

REF

AGND

DB11

DB10

DB9

DB8

DB7

DB6

DB5

DGND

V

ANA

V

DIG

A1

A0

CLK

BUSY

WR

CS

RD

DB0

DB1

DB2

DB3

DB4

28

27

26

25

24

23

22

21

20

19

18

17

16

15

ADS7842E

NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.

NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”

may cause permanent damage to the device. Exposure to absolute maximum

conditions for extended periods may affect device reliability.