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ADS7842EG4 Datasheet(PDF) 2 Page - Texas Instruments |
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ADS7842EG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 20 page ADS7842 SBAS103C 2 www.ti.com PIN NAME DESCRIPTION 1 AIN0 Analog Input Channel 0 2 AIN1 Analog Input Channel 1 3 AIN2 Analog Input Channel 2 4 AIN3 Analog Input Channel 3 5VREF Voltage Reference Input. See Electrical Characteris- tics Tables for ranges. 6 AGND Analog Ground 7 DB11 Data Bit 11 (MSB) 8 DB10 Data Bit 10 9 DB9 Data Bit 9 10 DB8 Data Bit 8 11 DB7 Data Bit 7 12 DB6 Data Bit 6 13 DB5 Data Bit 5 14 DGND Digital Ground 15 DB4 Data Bit 4 16 DB3 Data Bit 3 17 DB2 Data Bit 2 18 DB1 Data Bit 1 19 DB0 Data Bit 0 (LSB) 20 RD Read Input. Active LOW. Reads the data outputs in combination with CS. 21 CS Chip Select Input. Active LOW. The combination of CS taken LOW and WR taken LOW initiates a new conversion and places the outputs in the tri-state mode. 22 WR Write Input. Active LOW. Starts a new conversion and selects an analog channel via address inputs A0 and A1, in combination with CS. 23 BUSY BUSY goes LOW and stays LOW during a conversion. BUSY rises when a conversion is complete and enables the parallel outputs. 24 CLK External Clock Input. The clock speed determines the conversion rate by the equation fCLK = 16 • fSAMPLE. 25, 26 A0, A1 Address Inputs. Selects one of four analog input channels in combination with CS and WR. The address inputs are latched on the rising edge of either RD or WR. A1 A0 Channel Selected 0 0 AIN0 0 1 AIN1 1 0 AIN2 1 1 AIN3 27 VDIG Digital Supply Input. Nominally +5V. 28 VANA Analog Supply Input. Nominally +5V. MINIMUM RELATIVE SPECIFIED ACCURACY SINAD PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT PRODUCT (LSB) (dB) PACKAGE-LEAD DESIGNATOR(1) RANGE MARKING NUMBER MEDIA, QUANTITY ADS7842E ±2 68 SSOP-28 DB –40 °C to +85°C ADS7842E ADS7842E Rails, 48 "" " " " " " ADS7842E/1K Tape and Reel, 1000 ADS7842EB ±1 70 SSOP-28 DB –40 °C to +85°C ADS7842EB ADS7842EB Rails, 48 "" " " " " " ADS7842EB/1K Tape and Reel, 1000 ABSOLUTE MAXIMUM RATINGS(1) +VCC to GND ........................................................................ –0.3V to +6V Analog Inputs to GND ............................................ –0.3V to +VCC + 0.3V Digital Inputs to GND ........................................................... –0.3V to +6V Power Dissipation .......................................................................... 250mW Maximum Junction Temperature ................................................... +150 °C Operating Temperature Range ........................................ –40 °C to +85°C Storage Temperature Range ......................................... –65 °C to +150°C Lead Temperature (soldering, 10s) ............................................... +300 °C ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instru- ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degrada- tion to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION PIN CONFIGURATION Top View SSOP PIN DESCRIPTIONS 1 2 3 4 5 6 7 8 8 10 11 12 13 14 AIN0 AIN1 AIN2 AIN3 V REF AGND DB11 DB10 DB9 DB8 DB7 DB6 DB5 DGND V ANA V DIG A1 A0 CLK BUSY WR CS RD DB0 DB1 DB2 DB3 DB4 28 27 26 25 24 23 22 21 20 19 18 17 16 15 ADS7842E NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com. NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. |
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