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ADC16DX370RMET Datasheet(PDF) 66 Page - Texas Instruments |
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ADC16DX370RMET Datasheet(HTML) 66 Page - Texas Instruments |
66 / 77 page ADC16DX370 SNVSA18C – APRIL 2014 – REVISED AUGUST 2014 www.ti.com Layout Example (continued) Additional layout examples can be found on the associated EVM tools web page on www.ti.com. 11.3 Thermal Considerations The exposed thermal pad of the ADC16DX370 device draws heat from the silicon down into the PCB to prevent overheating and must attach to the landing pad with a quality solder connection to maximize thermal conductivity. Overly hot operating temperatures may be alleviated further by increasing the PCB size, filling surface layers with ground planes to increase heat radiation, or using a thermally conductive connection between the package top and a heat sink. 66 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: ADC16DX370 |
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