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ADC16DX370RMER Datasheet(PDF) 8 Page - Texas Instruments |
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ADC16DX370RMER Datasheet(HTML) 8 Page - Texas Instruments |
8 / 77 page ADC16DX370 SNVSA18C – APRIL 2014 – REVISED AUGUST 2014 www.ti.com 6.3 Recommended Operating Conditions Operation of the device beyond the recommended operating ratings is not recommended as it may degrade the device lifetime. MIN MAX UNIT Specified temperature –40 85 °C VA3.0 3.0-V analog supply voltage 2.85 3.45 V VA1.8 1.8-V analog supply voltage 1.7 1.9 V VA1.2 1.2-V analog supply voltage 1.15 1.25 V VD1.2 1.2-V digital supply voltage 1.15 1.25 V CLKIN duty cycle 30% 70% TJ Operating junction temperature 105 °C 6.4 Thermal Information THERMAL METRIC(1) WQFN (56 PINS) UNIT RθJA Thermal resistance, junction to ambient 24.9 RθJC(top) Thermal resistance, junction to package top 8.6 RθJB Thermal resistance, junction to board 3.0 °C/W φJT Characterization parameter, junction to package top 0.2 φJB Characterization parameter, junction to board 2.9 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 8 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: ADC16DX370 |
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