ADC16DX370RMER datasheet(8/77 Pages) TI1

Part #	ADC16DX370RMER

Description	ADC16DX370 Dual 16-Bit 370 MSPS ADC

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Manufacturer	TI1 [Texas Instruments]

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ADC16DX370

SNVSA18C – APRIL 2014 – REVISED AUGUST 2014

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6.3 Recommended Operating Conditions

Operation of the device beyond the recommended operating ratings is not recommended as it may degrade the device

lifetime.

MIN

MAX

UNIT

Specified temperature

–40

85

°C

VA3.0

3.0-V analog supply voltage

2.85

3.45

V

VA1.8

1.8-V analog supply voltage

1.7

1.9

V

VA1.2

1.2-V analog supply voltage

1.15

1.25

V

VD1.2

1.2-V digital supply voltage

1.15

1.25

V

CLKIN duty cycle

30%

70%

TJ

Operating junction temperature

105

°C

6.4 Thermal Information

THERMAL METRIC(1)

WQFN (56 PINS)

UNIT

RθJA

Thermal resistance, junction to ambient

24.9

RθJC(top)

Thermal resistance, junction to package top

8.6

RθJB

Thermal resistance, junction to board

3.0

°C/W

φJT

Characterization parameter, junction to package top

0.2

φJB

Characterization parameter, junction to board

2.9

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

8

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