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FODM3021 Datasheet(PDF) 9 Page - Fairchild Semiconductor |
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FODM3021 Datasheet(HTML) 9 Page - Fairchild Semiconductor |
9 / 10 page 11/10/03 Page 9 of 10 © 2003 Fairchild Semiconductor Corporation FODM3010 FODM3011 FODM3012 FODM3021 FODM3022 FODM3023 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM-PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS 0.024 (0.61) 0.100 (2.54) 0.060 (1.52) 0.310 (7.87) 0.190 (4.83) Footprint Drawing for PCB Layout Recommended Infrared Reflow Soldering Profile • Peak reflow temperature: 230°C (package surface temperature) for 30 seconds • Time of temperature higher than 210°C: 60 seconds or less • One time soldering reflow is recommended (heating) to 30 s to 60 s 90 s Time (s) 150 s 60 s 180°C 230°C (peak temperature) 210°C |
Similar Part No. - FODM3021 |
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Similar Description - FODM3021 |
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