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MAL218097251E3 Datasheet(PDF) 4 Page - Vishay Siliconix

Part No. MAL218097251E3
Description  Conductive Polymer Aluminum Capacitors SMD (Chip), Low Impedance
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

MAL218097251E3 Datasheet(HTML) 4 Page - Vishay Siliconix

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180 CPS
www.vishay.com
Vishay BCcomponents
Revision: 20-May-15
4
Document Number: 28415
For technical questions, contact: aluminumcaps1@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Table 3
ADVANCED SOLDERING PROFILE FOR LEAD (Pb)-FREE REFLOW PROCESS
Fig. 4 - Maximum temperature load during reflow soldering
Table 4
Note
• Temperature measuring point on top of the case and on terminals.
RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters
CASE CODE
a
b
c
0506
1.4
3.0
1.6
0606
1.9
3.5
1.6
0608
1.9
3.5
1.6
0807
3.0
3.5
2.5
0812
3.0
3.5
2.5
1008
4.0
4.0
2.5
1013
4.0
4.0
2.5
REFLOW SOLDERING CONDITIONS for MAL2180xxxE3
PROFILE FEATURES
CASE CODE
0506 TO 1013
Max. time from 25 °C to TPeak
300 s
Max. ramp-up rate to 150 °C
3 K/s
Max. time from 150 °C to 200 °C (t1)
150 s
Max. time from 190 °C to 200 °C (t2)
110 s
Ramp up rate from 200 °C to TPeak
0.5 K/s to 3 K/s
Max. time above TLiquidus (217 °C) (t3)90 s
Max. time above 230 °C (t4)
70 s
Peak temperature TPeak
260 °C
Max. time above TPeak minus 5 °C
40 s
Ramp-down rate from TLiquidus
3 K/s to 6 K/s
t
1
200
190
150
25
217
230
T
Peak
time (s)
T (°C)
t
2
t
3
t
4


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