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TLV2372IDGK Datasheet(PDF) 17 Page - Texas Instruments

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Part # TLV2372IDGK
Description  FAMILY OF 550- UA/CH 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLV2372IDGK Datasheet(HTML) 17 Page - Texas Instruments

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TLV2370, TLV2371, TLV2372, TLV2373, TLV2374, TLV2375
FAMILY OF 550 µA/Ch 3MHz RAILTORAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS270C − MARCH 2001 − REVISED DECEMBER 2003
17
WWW.TI.COM
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251−1443
APPLICATION INFORMATION
general power dissipation considerations
For a given
θJA, the maximum power dissipation is shown in Figure 37 and is calculated by the following formula:
P
D +
T
MAX
–T
A
q
JA
Where:
PD
= Maximum power dissipation of TLV237x IC (watts)
TMAX = Absolute maximum junction temperature (150°C)
TA
= Free-ambient air temperature (
°C)
θJA = θJC + θCA
θJC = Thermal coefficient from junction to case
θCA = Thermal coefficient from case to ambient air (°C/W)
1
0.75
0.5
0
−55 −40 −25 −10 5
1.25
1.5
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
1.75
20 35 50
0.25
TA − Free-Air Temperature − °C
2
65 80 95 110 125
MSOP Package
Low-K Test PCB
θJA = 260°C/W
TJ = 150°C
PDIP Package
Low-K Test PCB
θJA = 104°C/W
SOIC Package
Low-K Test PCB
θJA = 176°C/W
SOT-23 Package
Low-K Test PCB
θJA = 324°C/W
NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.
Figure 37. Maximum Power Dissipation vs Free-Air Temperature


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