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TLV2372IDGK Datasheet(PDF) 16 Page - Texas Instruments

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Part No. TLV2372IDGK
Description  FAMILY OF 550- UA/CH 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLV2372IDGK Datasheet(HTML) 16 Page - Texas Instruments

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TLV2370, TLV2371, TLV2372, TLV2373, TLV2374, TLV2375
FAMILY OF 550 µA/Ch 3MHz RAILTORAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS270C − MARCH 2001 − REVISED DECEMBER 2003
16
WWW.TI.COM
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251−1443
APPLICATION INFORMATION
circuit layout considerations
To achieve the levels of high performance of the TLV237x, follow proper printed-circuit board design techniques.
A general set of guidelines is given in the following.
D Ground planes—It is highly recommended that a ground plane be used on the board to provide all
components with a low inductive ground connection. However, in the areas of the amplifier inputs and
output, the ground plane can be removed to minimize the stray capacitance.
D Proper power supply decoupling—Use a 6.8-µF tantalum capacitor in parallel with a 0.1-µF ceramic
capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers
depending on the application, but a 0.1-
µF ceramic capacitor should always be used on the supply terminal
of every amplifier. In addition, the 0.1-
µF capacitor should be placed as close as possible to the supply
terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less
effective. The designer should strive for distances of less than 0.1 inches between the device power
terminals and the ceramic capacitors.
D Sockets—Sockets can be used but are not recommended. The additional lead inductance in the socket pins
will often lead to stability problems. Surface-mount packages soldered directly to the printed-circuit board
is the best implementation.
D Short trace runs/compact part placements—Optimum high performance is achieved when stray series
inductance has been minimized. To realize this, the circuit layout should be made as compact as possible,
thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting input of
the amplifier. Its length should be kept as short as possible. This helps to minimize stray capacitance at the
input of the amplifier.
D Surface-mount passive components—Using surface-mount passive components is recommended for high
performance amplifier circuits for several reasons. First, because of the extremely low lead inductance of
surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small
size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray
inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be
kept as short as possible.
shutdown function
Three members of the TLV237x family (TLV2370/3/5) have a shutdown terminal for conserving battery life in
portable applications. When the shutdown terminal is tied low, the supply current is reduced to 25
µA/channel,
the amplifier is disabled, and the outputs are placed in a high impedance mode. To enable the amplifier, the
shutdown terminal can either be left floating or pulled high. When the shutdown terminal is left floating, care
should be taken to ensure that parasitic leakage current at the shutdown terminal does not inadvertently place
the operational amplifier into shutdown.


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