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IXDI602SI Datasheet(PDF) 11 Page - IXYS Corporation |
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IXDI602SI Datasheet(HTML) 11 Page - IXYS Corporation |
11 / 13 page INTEGRATED CIRCUITS DIVISION IXD_602 R06 www.ixysic.com 11 5.4 Mechanical Dimensions 5.4.1 SIA (8-Pin SOIC) 5.4.2 SI (8-Pin Power SOIC with Exposed Metal Back) Note: The exposed metal pad on the back of the SI package should be connected to GND. It is not suitable for carrying current. Dimensions mm (inches) PCB Land Pattern Pin 1 Pin 8 3.937 ± 0.254 (0.155 ± 0.010) 5.994 ± 0.254 (0.236 ± 0.010) 0.406 ± 0.076 (0.016 ± 0.003) 4.928 ± 0.254 (0.194 ± 0.010) 1.270 REF (0.050) 1.346 ± 0.076 (0.053 ± 0.003) 0.051 MIN - 0.254 MAX (0.002 MIN - 0.010 MAX) 0.559 ± 0.254 (0.022 ± 0.010) 0.762 ± 0.254 (0.030 ± 0.010) 1.27 (0.050) 5.40 (0.213) 1.55 (0.061) 0.60 (0.024) Recommended PCB Land Pattern Dimensions mm (inches) 1.346 ± 0.076 (0.053 ± 0.003) 0.051 MIN - 0.254 MAX (0.002 MIN - 0.010 MAX) 4.928 ± 0.254 (0.194 ± 0.010) Pin 1 0.406 ± 0.076 (0.016 ± 0.003) 5.994 ± 0.254 (0.236 ± 0.010) 3.937 ± 0.254 (0.155 ± 0.010) 1.270 REF (0.050) 0.762 ± 0.254 (0.030 ± 0.010) 7º 2.540 ± 0.254 (0.100 ± 0.010) 3.556 ± 0.254 (0.140 ±0.010) 1.27 (0.050) 5.40 (0.209) 1.55 (0.061) 0.60 (0.024) 2.75 (0.108) 3.80 (0.150) |
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