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ZMM3.9 Datasheet(PDF) 3 Page - Diotec Semiconductor |
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ZMM3.9 Datasheet(HTML) 3 Page - Diotec Semiconductor |
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ZMM1 ... ZMM75 1 Disclaimer: See data book page 2 or website Haftungssauschluss: Siehe Datenbuch Seite 2 oder Internet 1 Mounted on P.C. board with 25 mm2 copper pads at each terminal Montage auf Leiterplatte mit 25 mm2 Kupferbelag (Lötpad an jedem Anschluss © Diotec Semiconductor AG http://www.diotec.com/ 3 10 1 10 3 -1 10 10 2 [mA] I F Forward characteristics (typical values) Durchlasskennlinien (typische Werte) 0 V F 0.4 0.6 0.8 1.0 [V] 1.4 T = 100°C j T = 25°C j [pF] [V] C j V Z T = 25°C f = 1.0 MHz j V = 1V R V = 2V R Junction capacitance vs. zener voltage (typical) Sperrschichtkapazität in Abh. v.d. Zenerspg. (typ.) V = 2V R V = 1V R 0 2 3 4 5 6 7 8 10 [V] V Z [mA] 50 150 0 100 I Z Typical breakdown characteristic Typische Abbruchspannung – tested with pulses – gemessen mit Impulsen 5,6 6,2 6,8 7,5 8,2 9,1 I Zmax T = 25°C j I = 5 mA Z 2.7 3.3 3.8 4.7 18 24 30 36 43 51 62 56 68 75 T = 25°C j I Zmax Typical breakdown characteristic Typische Abbruchspannung – tested with pulses – gemessen mit Impulsen 10 120 100 80 60 40 20 0 [%] P tot Power dissipation versus ambient temperature ) Verlustleistung in Abh. von d. Umgebungstemp. ) 1 1 [°C] T A 150 100 50 0 |
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