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CM453232-150JL Datasheet(PDF) 1 Page - Bourns Electronic Solutions

Part # CM453232-150JL
Description  SMT Chip Inductors
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Manufacturer  BOURNS [Bourns Electronic Solutions]
Direct Link  http://www.bourns.com
Logo BOURNS - Bourns Electronic Solutions

CM453232-150JL Datasheet(HTML) 1 Page - Bourns Electronic Solutions

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Features
n
Highresistancetoheatandhumidity
n
Resistancetomechanicalshockand
pressure
n
Accuratedimensionsforautomatic
surfacemounting
n
Wideinductancerange(1.0nHto1000µH)
n
RoHScompliant*
CM45SeriesSMTChipInductors
*RoHSDirective2002/95/ECJan.27,2003includingannexandRoHSRecast2011/65/EUJune8,2011.
Specificationsaresubjecttochangewithoutnotice.
Thedevicecharacteristicsandparametersinthisdatasheetcananddovaryindifferentapplicationsandactualdeviceperformancemayvaryovertime.
Usersshouldverifyactualdeviceperformanceintheirspecificapplications.
Temperature Rise ...................................................................................................................................................................... 20 ˚C max.
Ambient Temperature .............................................................................................................................................................. 100 ˚C max.
Operating Temperature....................................................................................................................................................-40 °C to +125 °C
Storage Temperature.......................................................................................................................................................-40 °C to +125 °C
Resistance to Soldering Heat.........................................................................................................................................260 ˚C, 5 seconds
General Specifications
Core Material............................................................................................................................................................................Ferrite Core
Coil Type...................................................................................................................................................................................Copper wire
Enclosure..................................................................................................................................................................................Epoxy resin
Terminal...................................................................................................................................................................................................Sn
Materials
a
b
c
2.0 to 2.4
(.079 to .094)
5.0 to 5.3
(.197 to .209)
1.4 to 1.7
(.055 to .067)
Product Dimensions
DIMENSIONS:
MM
(INCHES)
Recommended Land Pattern Dimensions
0.2±0.1
(.008±.004)
0.3±0.15
(.012±.006)
1.0±0.1
(.040±.004)
0.5±0.1
(.020±.004)
CM10:
0.80±0.15
(.032±.006)
CM16:
0.5±0.1
(.020±.004)
CM10:
CM10:
CM10:
CM16:
0.2±0.1
(.008±.004)
0.3±0.15
(.012±.006)
CM10:
CM16:
1.6±0.15
(.063±.006)
CM16:
0.80±0.15
(.032±.006)
CM16:
3.2
(.126)
2.5
(.079)
1.9
(.075)
2.2
(.086)
0.6
(.024)
Marking
4.5±0.3
(.177±.012)
3.2±0.2
(.125±.008)
Marking
1.2
(.047)
1.7±0.2
(.066±.008)
3.2±0.2
(.125±.008)
1.0
(.039)
1.0
(.039)
CM100505, CM160808
CM322522
CM453232
a
c
b
Soldering Profile
25
75
125
175
225
275
050
100
150200
250300
Time (Seconds)
120-150 seconds
60 seconds
maximum
260 °C peak
190°C
150 °C
220 °C
Ramp Down
5 °C/second
<1> 255 °C
<1>Maximum of 10 seconds
between +255 °C and +260 °C
Ramp Up
4 °C/second maximum
10 secondsminimum
25
75
125
175
225
275
050100
150200
250300
Time (Seconds)
120-150seconds
60 seconds
maximum
150 °C
183 °C
170 °C
Ramp Down
5 °C/second
<1> 245 °C
<1>5 seconds maximum
at +245 °C
Ramp Up
4 °C/second maximum
10 secondsminimum


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