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SN74LVC1G66 Datasheet(PDF) 2 Page - Texas Instruments

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Part No. SN74LVC1G66
Description  SINGLE BILATERAL ANALOG SWITCH
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
Logo TI - Texas Instruments

SN74LVC1G66 Datasheet(HTML) 2 Page - Texas Instruments

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SN74LVC1G66
SINGLE BILATERAL ANALOG SWITCH
SCES323H − JUNE 2001 − REVISED SEPTEMBER 2003
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
description/ordering information (continued)
NanoStar
 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
FUNCTION TABLE
CONTROL
INPUT
(C)
SWITCH
L
OFF
H
ON
logic diagram (positive logic)
B
C
A
1
4
2
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC (see Note 1)
−0.5 V to 6.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Notes 1 and 2)
−0.5 V to 6.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Switch I/O voltage range, VI/O (see Notes 1, 2, and 3)
−0.5 V to VCC + 0.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . .
Control input clamp current, IIK (VI < 0)
−50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I/O port diode current, IIOK (VI/O < 0 or VI/O > VCC)
±50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
On-state switch current, IT (VI/O = 0 to VCC)
±50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND
±100 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
θJA (see Note 4): DBV package
206
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DCK package
252
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
YEA/YZA package
154
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . .
YEP/YZP package
132
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg
−65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. All voltages are with respect to ground, unless otherwise specified.
2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
3. This value is limited to 5.5 V maximum.
4. The package thermal impedance is calculated in accordance with JESD 51-7.


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