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SN74LVC1G66 Datasheet(PDF) 1 Page - Texas Instruments

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Part No. SN74LVC1G66
Description  SINGLE BILATERAL ANALOG SWITCH
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

SN74LVC1G66 Datasheet(HTML) 1 Page - Texas Instruments

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SN74LVC1G66
SINGLE BILATERAL ANALOG SWITCH
SCES323H − JUNE 2001 − REVISED SEPTEMBER 2003
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Available in the Texas Instruments
NanoStar
 and NanoFree Packages
D 1.65-V to 5.5-V VCC Operation
D Inputs Accept Voltages to 5.5 V
D Max tpd of 0.8 ns at 3.3 V
D High On-Off Output Voltage Ratio
D High Degree of Linearity
D High Speed, Typically 0.5 ns
(VCC = 3 V, CL = 50 pF)
D Low On-State Resistance, Typically ≈5.5 Ω
(VCC = 4.5 V)
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
This single analog switch is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G66 can handle both analog and digital signals. The device permits signals with amplitudes of
up to 5.5 V (peak) to be transmitted in either direction.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar
 − WCSP (DSBGA)
0.17-mm Small Bump − YEA
SN74LVC1G66YEAR
−40
°C to 85°C
NanoFree
 − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
Reel of 3000
SN74LVC1G66YZAR
_ _ _C6_
−40
°C to 85°C
NanoStar
 − WCSP (DSBGA)
0.23-mm Large Bump − YEP
Reel of 3000
SN74LVC1G66YEPR
_ _ _C6_
NanoFree
 − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
SN74LVC1G66YZPR
SOT (SOT-23) − DBV
Reel of 3000
SN74LVC1G66DBVR
C66_
−40
°C to 85°C
SOT (SOT-23) − DBV
Reel of 250
SN74LVC1G66DBVT
C66_
−40
°C to 85°C
SOT (SC-70) − DCK
Reel of 3000
SN74LVC1G66DCKR
C6_
SOT (SC-70) − DCK
Reel of 250
SN74LVC1G66DCKT
C6_
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
= Pb-free).
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
5
4
A
B
GND
VCC
C
3
2
1
4
5
GND
B
A
C
VCC
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
Copyright
 2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.


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