1.Operating Environment

Do not use this product under the following environmental conditions, on deterioration of the performance, such as

insulation resistance may result from the use.

(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)

(2) in the atmosphere where liquid such as organic solvent, may splash on the products.

(3) in the atmosphere where dust rises.

2. Caution (Rating)

Do not use products beyond the Operating Temperature Range, Rated Voltage and Rated Current.

3. Attention regarding product's lay out

< Attention regarding the heat generated by other products >

Please provide special attention when mounting products in close proximity to other products that radiate heat.

4. Attention regarding chip mounting

An excessively low bottom dead point of the suction nozzle imposes great force on the chip during mounting,

causing cracked chips.

Please set the suction nozzle's bottom dead point on the upper surface of the board, after the board is adjusted flat.

The chip received force (static loading) from the suction nozzle's should be 1N to 3N.

5. Note for Assembling

< Thermal Shock >

Pre-heating should be in such a way that the temperature difference between solder and products surface is limited

to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is

limited to 100°C max.

Caution

!

JEMCPC-02249A

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