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CY6116A
CY6117A
6116A: 11/8/89
Revision: Monday, November 8, 1993
9
Package Diagrams (continued)
24Lead (600Mil) Molded DIP P11
E Cypress Semiconductor Corporation, 1992. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for
the use of any circuitry other than circuitry embodied in a Cypress Semiconductor Corporation product. Nor does it convey or imply any license under patent or other rights. Cypress Semicon
ductor does not authorize its products for use as critical components in lifesupport systems where a malfunction or failure of the product may reasonably be expected to result in significant
injury to the user. The inclusion of Cypress Semiconductor products in lifesupport systems applications implies that the manufacturer assumes all risk of such use and in so doing indemnifies
Cypress Semiconductor against all damages.
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